1.1 Features

  • Arm Cortex-A7 Core
    • Arm TrustZone®
    • Arm® Neon™ multimedia architecture
    • Floating Point Unit
    • Embedded Trace module with instruction trace stream, including 16 Kbytes of CoreSight™ Embedded Trace buffer
    • 32 Kbytes of L1 data cache, 32 Kbytes of L1 instruction cache
    • 256 Kbytes of L2 cache
    • Up to 1 GHz operational frequency
    • Voltage and frequency scaling support
    • 64-bit generic timers
  • Memories
    • Internal memory architecture
      • 128 Kbytes of SRAM
      • 80 Kbytes of ROM, embedding a secure boot loader (boot on QSPI NOR, SLC/MLC NAND, SD card, e.MMC)
      • 96 Kbytes ROM for NAND Flash ECC tables
      • 40 Kbytes ROM for crypto libraries (RSA, ECC, etc.)
      • 11 Kbytes of internal OTP
    • External memory support
      • 16-bit high-bandwidth, Double Data Rate Multi-Port Dynamic RAM controller. Supports up to 16 Gbit 8-bank DDR2/DDR3/DDR3L/LPDDR2/LPDDR3 up to 533 MHz
      • 16-bit Static Memory controller, FPGA and memory-mapped peripheral support with synchronous clock
  • System
    • Power-on reset cells, reset controller, shutdown controller, watchdog and secure watchdog timers running on internal slow RC oscillator (32 kHz typical) and real-time clock running on slow crystal oscillator (32.768 kHz)
    • Two internal trimmed RC oscillators with typical values: 32 kHz and 12 MHz
    • Two crystal oscillators: 32.768 kHz and 20 to 50 MHz
    • Nine PLLs for core, system bus and peripherals, serial interfaces, DDR I/Os, pixel clock, audio, USB and Ethernet
    • Two 32-channel DMA with per-channel security configuration
    • One 8-channel DMA dedicated to memory-to-memory transactions
    • Eight programmable clock output signals
  • Power Considerations
    • Different power domains and power modes to reduce power consumption
    • Low-power consumption in Backup mode with 5 Kbytes of secure backup SRAM and DDR-SDRAM in Self-Refresh mode
    • Low-power with SRAM and register retention, wake-up from various events (USB, CAN, Ethernet WOL, FLEXCOMs), internal events (RTC, timer) and I/O activity
    • Embedded LDOs for analog and PLLs to enable low-cost power management solutions
    • Optimum connection to Microchip MCP16501/2 PMICs to enter and exit various power modes of the application
  • Multimedia Peripherals
    • Audio
      • Two synchronous serial controllers, each with up to eight channels of up to 32-bit TDM data
      • Two inter-IC sound multi-channel controller with TDM256 support
      • Up to two 4-channel pulse density microphone controllers; support for eight microphones in parallel
      • One Sony/Philips Digital Interface transmitter and receiver
      • Audio sample rate converter including four stereo channels
  • Display Subsystem Supporting One Display Up to WXGA/720p (1366x768p60/1280x720p60)
    • One 4-lane MIPI D-PHY interface and one DSI controller
    • One single-channel LVDS interface, and one LVDS controller
    • 8-bit databus serial RGB interface
    • One LCD controller with one base layer, one overlay and one high-end overlay
    • One 2D GPU controller with up to WXGA/720p target display resolution and support for RGB and YUV
  • Connectivity
    • USB Subsystem:
      • Two high-speed USB Devices and three high-speed USB Hosts sharing three on-chip transceivers
      • Two USB Type-C™ controllers (TCPC)
    • Two 10/100/1000 Gigabit Ethernet MAC supporting:
      • RGMII and RMII interfaces
      • Energy efficiency as per IEEE 802.3az
      • Ethernet AVB support with IEEE802.1AS timestamping
      • IEEE802.1Qav credit-based traffic shaping hardware support
      • IEEE1588 Precision Time Protocol
      • IEEE1588 Timestamp Unit with TSU timer comparison signal triggering a Timer Counter and available on a PIO line
      • Support for traffic scheduling and Time Sensitive Networking (TSN/AVB)
      • Packet buffer support
    • Five flexible data rate CAN-FD controllers with SRAM-based mailboxes with time- and event-triggered transmission, flexible data rate. 32-bit Timestamp unit.
    • Eleven FLEXCOMs supporting U(S)ART, SPI, TWI/I2C with FIFOs
    • I3C controller interface supporting FM, FM+, SDR and HDR-DDR modes
  • Mass Storage
    • One 8-bit high-speed Memory Card Host with e.MMC 5.1 (HS400), SD3.0, SDR104 mode support
    • One 4-bit high-speed Memory Card Host with e.MMC 5.1 (HS200), SD3.0, SDR104 mode support
    • One 4-bit high-speed Memory Card Host with SD3.0, SDR104 mode support
    • One Octal Serial Peripheral Interface supporting high-speed DDR mode
    • One Quad Serial Peripheral Interface
    • 8-bit SLC and MLC NAND controller with up to 32-bit Error Correcting Code
  • General-Purpose Analog and Digital Peripherals
    • Six 64-bit Periodic Interval Timers
    • Two three-channel 32-bit Timer Counters with PWM generation
    • One four-channel 16-bit PWM controller
    • One 19-channel 12-bit 1 Msps Analog-to-Digital converter
    • One 4-differential inputs Analog Comparator controller
  • Safety
    • Zero-power power-on reset cells
    • Main crystal monitor and clock failure detector with failsafe switchover to Main RC oscillator
    • 32 kHz crystal monitor and clock failure detector, switch to internal 32 kHz RC
    • Integrity Check Monitor based on SHA256
    • One Watchdog Timer running on RC oscillator
    • Register write protection
  • Security
    • TrustZone support
    • One Secure TrustZone Watchdog Timer running on RC oscillator, providing protection against TrustZone starvation
    • Temperature, voltage and frequency monitoring (also applicable for safety purposes)
    • Secure backup SRAM
      • 5 Kbytes scrambled with non-imprinting support powered with VBAT or VDDIN33:
        • 1 Kbyte non-erasable on tamper detection
        • 4 Kbytes erasable on tamper detection
    • Four tamper pins for static or dynamic detection
      • Can be used as regular wake-up lines
    • 256-bit backup register, erasable on tamper detection (tamper pins or monitor outputs). Time Stamping of tamper events.
    • Programmable OTP with bits available for user purposes
    • Configurable JTAG/SWD security (full debug, Non-secure-only debug, no debug)
    • Two independent 128-bit AES on-the-fly encryption/decryption on DDR memory, SMC, QSPI0 and QSPI1, including automatic key load at startup. Separate key for Secure and Non-secure accesses (TZAESB)
    • Secure RTC
  • Cryptography
    • Physically Unclonable Function with automatic key load to hardware encryption engines
    • SHA (SHA1, SHA224, SHA256, SHA384, SHA512) compliant with FIPS Publications 180-2
    • AES: 256-, 192-, 128-bit key algorithm, compliant with FIPS PUB 197 specifications
    • TDES: Two-key or three-key algorithms, compliant with FIPS PUB 46-3 specifications
    • True Random Number Generator with health tests compliant with NIST Special Publication 800-22 Tests Suite and FIPS PUB 140-2 and 140-3
    • Public Key Coprocessor (CPKCC) and associated Classical Public Key Cryptography Library (CPKCL) for RSA, DSA, ECC GF(2n), ECC GF(p) and associated library for RSA4096, ECC521.
  • I/O Ports
    • Up to 142 general-purpose I/Os
    • Fully programmable through Set/Clear registers
    • Multiplexing of up to eight peripheral functions per I/O line
    • Each I/O line can be assigned to a peripheral or used as a general-purpose I/O
    • Synchronous output, possibility to set or clear simultaneously up to 32 I/O lines in a single write
    • General-purpose analog and digital inputs are tolerant to positive and negative current injection
  • Design for Low Electromagnetic Interference (EMI)
    • Slew rate controlled I/Os
    • DDR Phy with impedance-calibrated drivers
    • Programmable spread spectrum PLLs
    • Careful BGA power/ground ball assignment to provide optimum decoupling capacitors placement
  • Microchip Recommended Power Management Integrated Circuits (PMICs)
    • MCP16502, 6-channel PMIC with I²C control interface; supports dynamic voltage scaling and processor Low-Power modes (BSR)
    • MCP16501, 4-channel PMIC optimized for compact PCB layout; supports processor Low-Power mode (BSR)
  • Operating Conditions
    • Junction temperature range (TJ): Industrial (-40°C to +105°C)
  • Package
    • 343-ball BGA 14x14x1.2 mm, 0.65 mm pitch, optimized for standard class PCB layout (down to 4 layers)