8 Revision History
Revision C (February 2026)
Note: No changes were made to the actual silicon. Changes are only
to the data sheet.
- Features:
- Updated random number generator bullet to indicate a True Random Number Generator (TRNG)
- Corrected SWI-PWM speed to 100 kbps
- Added XSFN package
- Use Cases: Updated Use Cases
- Random Number Generator (RNG):
- Updated to indicate that the RNG is a TRNG
- Added ESV and CAVP certification information
- Updated SP 800-90C to the released version of the spec
- ECC206 Trust Platform Variants and Provisioning Services: Added EV14Y33A Evaluation Kit
- Package Drawings: Added XSFN package outline drawings
- Product Identification System
- Updated for XSFN package
- Updated ordering information to “Carrier Type”
Revision B (February 2025)
Note: No changes were made to the actual silicon. Changes are only
to the data sheet.
- DC Parameters: Single-Wire Interface – Parasitic Power Mode: Added Theta-JA for 2-Pad VSFN package
- Product Identification System: Product identification is now a separate section and not part of the Back Matter
- Microchip Information: Back Matter simplified per Microchip’s new standard
Revision A (March 2023)
- Original release of the document
