3 IR Reflow
Suggested IR Profile: Devices are built using lead free epoxy and can be subjected to standard lead free IR reflow conditions shown in the table below. Contact pads are gold over nickel and lower maximum temperatures can also be used, such as 220°C.
| Parameter | Symbol | Value |
|---|---|---|
| Pre-heat Time | ts | 200 sec. max. |
| Ramp Up | RUP | 3°C/sec. max. |
| Time above 217°C | tL | 150 sec. max. |
| Time to Peak Temperature | tAMB-P | 480 sec. max. |
| Time at 260°C | tP | 30 sec. max. |
| Time at 240°C | tP2 | 60 sec. max. |
| Ramp Down | RDN | 6°C/sec. max. |