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PIC32CX-BZ3 and WBZ35x Family Data Sheet

PIC32CX-BZ3 WBZ350 WBZ351

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44 Packaging Information
44.2 WBZ35x Module Packaging Information
44.2.2 WBZ35x Module Packaging Dimension

Introduction
PIC32CX-BZ3 SoC Family Features
WBZ35x Module Features
Acronyms and Abbreviations
1 Ordering Information
2 Configuration Summary
3 PIC32CX-BZ3 SoC Description
4 WBZ35x Module Description
5 Pinout and Signal Descriptions List
6 I/O Ports and Peripheral Pin Select (PPS)
7 Power Subsystem
8 Product Memory Mapping Overview
9 Processor and Architecture
10 Prefetch Cache (PCHE)
11 Cortex M Cache Controller (CMCC)
12 Secure Boot ROM
13 eFuse Controller
14 Security Features
15 Flash Controller (FC)
16 Device Service Unit (DSU)
17 Clock and Reset Unit (CRU)
18 Power Management Unit (PMU)
19 Watchdog Timer (WDT)
20 Deadman Timer (DMT)
21 RAM Error Correction Code (RAMECC)
22 System Configuration and Register Locking (CFG)
23 Peripheral Module Disable (PMD)
24 Peripheral Access Controller (PAC)
25 Real-Time Counter and Calendar (RTCC)
26 Direct Memory Access Controller (DMAC)
27 External Interrupt Controller (EIC)
28 Configurable Custom Logic (CCL)
29 Frequency Meter (FREQM)
30 Event System (EVSYS)
31 Serial Communication Interface (SERCOM)
32 SERCOM Synchronous and Asynchronous Receiver and Transmitter (SERCOM USART)
33 SERCOM Serial Peripheral Interface (SERCOM SPI)
34 SERCOM Inter-Integrated Circuit (SERCOM I²C)
35 Quad Serial Peripheral Interface (QSPI)
36 Analog-to-Digital Converter (ADC)
37 Capacitive Voltage Divider (CVD) Controller for Touch Sensing
38 Analog Comparators (AC)
39 Digital-to-Analog Converter (DAC)
40 Timer/Counter (TC)
41 Timer/Counter for Control Applications (TCC)
42 802.15.4 Bluetooth® Radio Subsystem
43 Electrical Characteristics
44 Packaging Information
- 44.1 PIC32CX-BZ3 SoC Packaging Information
- 44.2 WBZ35x Module Packaging Information
  - 44.2.1 WBZ35x Module Packaging Marking
  - 44.2.2 WBZ35x Module Packaging Dimension
    - 44.2.2.1 WBZ351 Module Packaging Dimension
    - 44.2.2.2 WBZ350 Module Packaging Dimension
45 Appendix A: Regulatory Approval
46 Appendix B: Acronyms and Abbreviations
47 Document Revision History
Microchip Information

44.2.2 WBZ35x Module Packaging Dimension

This section provides the package dimension details of the WBZ35x Module.

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