10.1 427-Ball TFBGA Mechanical Characteristics

Table 10-1. 427-ball TFBGA Package Characteristics
Moisture sensitivity levelMSL3
Table 10-2. Device and 427-ball TFBGA Package Weight
980mg
Table 10-3. Package Reference
JEDEC drawing referenceNA
J-STD-609 classificatione8
Table 10-4. 427-ball TFBGA Package Information
Ball land0.450 mm
Nominal ball diameter0.400 mm
Solder mask opening0.350 mm
Solder mask definitionSolder Mask Defined (SMD)
SolderSAC105