Throughout - Remove mention of MPLAB
IDE v8.xx, except where necessary.
Preface - Update to add “How To’s”
chapter reference and remove “XC16 Toolchain and MPLAB IDE v8” chapter
reference.
Section 2.5.10 “Interrupt Functions”
- corrected a function.
Section 4.2 “MPLAB X IDE and Tools
Installation” - updated the licensing information.
Section 4.5 “Project Setup” - updated
compiler options in MPLAB X IDE.
Section 5.4.1.2 “User-Defined
Libraries” - added information on contents.
Section 5.7.1 “Options Specific to
16-Bit Devices” - added --partition option for dual partition
devices.
Section 5.7.4 “Options for
Controlling Warnings and Errors” - split into subsections. Took information from the
table and made it into a subsection for -W.
Section 5.7.6 “Options for
Controlling Optimization”- split into subsections. Added info to made a subsection
for --ffunction-section option. Added a cross-reference from
Section 14.3 “Writing an Interrupt Service Routine”.
Section 6.3.3 “Compile Time Memory
Information” - added section Added dataflash argument to that
space attribute.
Section 10.3.1 “Auto and Non-Auto
Variables vs. Local and Global Variables” section created from the last two
paragraphs of Section 10.3.
Section 13.2.2 “Function Attributes”
and Section 14.5.2 “context Attribute” - added information for the
context attribute.
Section 13.8 “Function Call
Conventions” - updated the table for EDS pointer requirements.
Section 14.3.3 “Coding ISRs”, Section
14.4.1 “Interrupt Vector Usage” and Section 14.5.1 “Assembly and ISRs” - updated
code snippets.
Section 14.4 “Specifying the
Interrupt Vector” - added information about movable alternate interrupt tables, and
split remaining text into two subsections.
Section 19.4.5 “Device Features
Macros” - clarified __HAS_DMA__ macros.
Appendix G. “Built-in Functions.” -
added __builtin_write_NVM_secure and
__builtin_software_breakpoints; updated
__builtin_enable_interrupts and
__builtin_disable_interrupts.
The online versions of the documents are provided as a courtesy. Verify all content and data in the device’s PDF documentation found on the device product page.