36.8 Memory Programming Specifications

Table 36-8. Memory Programming Specifications
SymbolDescriptionMin.Typ.✝Max.UnitConditions
Data EEPROM Memory Specifications
ED*Data EEPROM byte endurance100k——Erase/Write cycles
tD_RETCharacteristic retention—40—YearTA = 55°C
tD_CEFull EEPROM Erase time—4—ms
tD_BPWByte/Page Write time—2—ms
tD_BPEByte/Page Erase time—2—ms
tD_BPWEAtomic Byte/Page Write/Erase time—4—ms
Program Flash Memory Specifications
EP*Flash memory cell endurance10k——Erase/Write cycles
tP_RETCharacteristic retention—40—YearTA = 55°C
VP_REWVDD for Erase/Write operationVDDMIN(1)—VDDMAXV
tP_CEChip Erase time—10—ms
tP_PEPage/Multipage Erase time—6—ms
tP_PWPage Write time—4—ms
tP_BPWEAtomic Byte/Page Write/Erase time—10—ms
tP_CEChip Erase from UPDI on locked device—80—ms

✝ Unless otherwise specified, data in the “Typ.” column is at TA = 25°C and VDD = 3.0V . These parameters are not tested and are for design guidance only.

* These parameters are characterized but not tested in production.

Note:
  1. The Brown-out Detector (BOD) configured with BODLEVEL0 is forced ON during Chip Erase. The erase attempt will fail if the supply voltage VDD is below VBOD for BODLEVEL0.