2.1 Device Packaging

Programmable devices come in many shapes and sizes. Most devices are available in the following physical configurations: DIP (Dual Inline Package), PLCC (Plastic Leaded Chip Carrier), QFP (Quad Flat Pack), BGA (Ball Grid Array), SOIC (Small Outline I.C.), TSOP (Thin Small Outline), PGA (Pin Grid Array), etc. These devices can be rectangular with pins on two sides, square with pins on all sides, or square with pins, pads or balls on the underside. It is important for the hardware and software development tools to fully support as many device types as possible to take full advantage of the myriad of devices on the market.