5.3 PIC32WM-BZ6 Module Routing Guidelines

• Use the multi-layer host board for routing signals on the inner layer and the bottom layer.
• The top layer (underneath the module) of the host board must be grounded with as many GND vias as possible.
• Avoid fan-out of the signals under the module or antenna area. Use a via to fan-out signals to the edge of the PIC32WM-BZ6 Module.
• For a better GND connection to the PIC32WM-BZ6 Module, solder the exposed GND pads of the PIC32WM-BZ6 Module on the host board.
• For the module GND pad, use a GND via of a minimum 10 mil (hole diameter) for good ground to all the layers and thermal conduction path.
• The recommendation is to have a series of resistors on the host board for all GPIOs. Place these resistors close to the PIC32WM-BZ6 Module.
• Place the SOSC crystal (32.768 kHz) on the host board close to the PIC32WM-BZ6 Module and follow the shortest trace routing length with no vias.
• USB differential pair signals are 90Ω impedance controlled on the PIC32WM-BZ6 Module PCB and the same must be followed on the host board.