Use the multi-layer host board for routing signals on the inner layer and the bottom layer.
The top layer (underneath the module) of the host board must be grounded with as many GND vias as possible.
Avoid fan-out of the signals under the module or antenna area. Use a via to fan-out signals to the edge of the PIC32WM-BZ6 Module.
For a better GND connection to the PIC32WM-BZ6 Module, solder the exposed GND pads of the PIC32WM-BZ6 Module on the host board.
For the module GND pad, use a GND via of a minimum 10 mil (hole diameter) for good ground to all the layers and thermal conduction path.
The recommendation is to have a series of resistors on the host board for all GPIOs. Place these resistors close to the PIC32WM-BZ6 Module.
Place the SOSC crystal (32.768 kHz) on the host board close to the PIC32WM-BZ6 Module and follow the shortest trace routing length with no vias.
USB differential pair signals are 90Ω impedance controlled on the PIC32WM-BZ6 Module PCB and the same must be followed on the host board.
Figure 5-5. Example of Host Board on Top Layer
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