3.3 Temperature Specifications
| Parameters | Sym. | Min. | Typ. | Max. | Units | Conditions |
|---|---|---|---|---|---|---|
| Temperature Ranges | ||||||
| Thermal Shutdown | TSD | — | 169 | — | °C | Rising Temperature (not production tested) |
| Thermal Shutdown Hysteresis | ΔTSD | — | 11 | — | °C | Falling Temperature (not production tested) |
| Thermal Package Resistances | ||||||
| Thermal Resistance, SOT-223-5LD | θJA | — | 68.3 | — | °C/W | JEDEC® standard 4-layer FR4 board with 1 oz. copper |
| θJB | — | 18.3 | — | °C/W | ||
| ΨJT | — | 6.6 | — | °C/W | ||
| Thermal Resistance, TO-252-5LD | θJA | — | 32.7 | — | °C/W | |
| θJB | — | 8.3 | — | °C/W | ||
| ΨJT | — | 3.8 | — | °C/W | ||