59.2.2 Junction Temperature

Table 59-2. Thermal Operation Conditions
Rating	Symbol	Min.	Typ.	Max.	Unit
Industrial Temperature Devices
Operating Ambient Temperature Range	T_A	-40	—	85	°C
Operating Junction Temperature Range	T_J	—	—	105	°C
V-temp Temperature Devices
Operating Ambient Temperature Range	T_A	-40	—	105	°C
Operating Junction Temperature Range	T_J	—	—	125	°C
Extended Temperature Range
Operating Ambient Temperature Range	T_A	-40	—	125	°C
Operating Junction Temperature Range	T_J	—	—	145	°C
Power Dissipation:
Internal Chip Power Dissipation: PINT = VDD x (IDD –∑ IOH) I/O Pin Power Dissipation: PI/O = ∑ (({VDD – VOH} x IOH) + ∑ (VOL x IOL))	P_D	PINT + PI/O			W
Maximum Allowed Power Dissipation	PDMAX	(TJ – TA)/θJA			W

Note:

θ_JA = Package thermal resistance, Junction-to-ambient (°C/W), see Thermal Resistance Data.
When heatsink is used, PDMAX = (TJ-TA)/(θ_HEATSINK+θ_JC). Here θ_HEATSINK = Thermal resistance (°C/W) specification of the external cooling device. θ_JC= Package thermal resistance, Junction-to-case thermal resistance (°C/W). See Table Thermal Resistance Data for additional information.