39.2 Absolute Maximum Ratings

Stresses beyond those listed in this section can cause permanent damage to the device. This is a stress rating only. Functional operation of the device at these or other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Table 39-1. Absolute Maximum Ratings
Parameter	Condition	Rating	Units
Ambient temperature under bias		-40 to +125	°C
Maximum junction temperature		145	°C
Storage temperature		-65 to +150	°C
Voltage on pins with respect to GND
On the V_DD pin		-0.3 to +6.5	V
On the V_DDIO2 pin		-0.3 to +6.5	V
On the RESET pin		-0.3 to (V_DD + 0.3)	V
On the MVIO pins		-0.3 to (V_DDIO2 + 0.3)	V
On all other pins		-0.3 to (V_DD + 0.3)	V
Maximum current
On the GND pin⁽¹⁾	-40°C ≤ T_A ≤ +85°C	350	mA
On the GND pin⁽¹⁾	+85°C < T_A ≤ +125°C	120	mA
On the V_DD pin⁽¹⁾	-40°C ≤ T_A ≤ +85°C	350	mA
On the V_DD pin⁽¹⁾	+85°C < T_A ≤ +125°C	120	mA
On the V_DDIO2 pin⁽¹⁾	-40°C ≤ T_A ≤ +85°C	350	mA
On the V_DDIO2 pin⁽¹⁾	+85°C < T_A ≤ +125°C	120	mA
On any standard I/O pin		±50	mA
Clamp current, I_K (V_PIN < 0 or V_PIN > V_DD)		±20	mA
Total power dissipation⁽²⁾		800	mW
Note: The maximum current rating requires even load distribution across I/O pins. The device package's power dissipation characterizations may limit the maximum current rating. See 39.9 Thermal Specifications to calculate device specifications. Power dissipation is calculated as follows: P_DIS = V_DD × {I_DD - Σ I_OH} + Σ {(V_DD - V_OH) × I_OH} + Σ (V_OI × I_OL)