12 Assembly Instructions

The module must be assembled onto the host printed circuit board using a controlled reflow soldering process. To ensure reliability of the assembly and protect the module and its components from excessive thermal stress, it is essential to use a low-temperature solder paste in conjunction with the corresponding low-temperature reflow profile. The soldering process must be strictly controlled in accordance with the solder paste manufacturer’s recommendations, including the preheating, hold, peak temperature, and cooling stages. The module must not be exposed to temperatures exceeding the specified limits of the low-temperature reflow profile, as such exposure could compromise the module’s integrity, the quality of the solder joints, and long-term reliability.

For more information on the process, refer to the “Reflow Profiles” section in the “System-On-Module (SOM) Assembly and Storage Guidelines” application note (see Reference Documents).