3.3.13 Serial Peripheral Interface (SERCOM SPI) Mode Electrical Specifications

Figure 3-2. SERCOMn SPI Host Module CPHA = 0 Timing Diagrams

Figure 3-3. SERCOMn SPI Host Module CPHA = 1 Timing Diagrams

Table 3-23. SPIn Module Host Mode Electrical Specifications⁽¹⁾
Standard Operating Conditions: V_DDIO = AVDD = 1.8V to 5.5V (unless otherwise stated) Operating Temperature: -40°C ≤ T_A ≤ +125°C for extended temperature
Param. No.	Symbol	Characteristics⁽¹⁾	Min.	Typ.	Max.	Units	Conditions
MSP_1	f_SCK	SCK frequency	—	—		MHz	Transmitter mode, CTRLB.RXEN = `0`, C_LOAD = 30 pF_(max)
			—	—			Full duplex transmit and receive mode, C_LOAD = 30 pF_(max) Loopback mode with one SPI communicating with another SPI on the same microcontroller (MCU)
			—	—	1/(2 × (t_MIS + NOTE2_{T V}))⁽²⁾		Full duplex transmit and receive mode, C_LOAD = 30 pf_(max). The maximum SPI speed of the MCU is partially dependent on the performance characteristics of the external SPI device. Therefore, faster speeds than the loopback mode described above may be possible using the formula.
MSP_3	t_SCL	SCK output low time	1/(2 × F_SCK)	—	—	µs	—
MSP_5	t_SCH	SCK output high time	1/(2 × F_SCK)	—	—	µs	—
MSP_7	t_SCF	SCK and MOSI output fall time	—	—	DI_27	ns	See parameter DI_27 in the I/O specifications
MSP_9	t_SCR	SCK and MOSI output rise time	—	—	DI_25	ns	See parameter DI_25 in the I/O specifications
MSP_11	t_MOV	MOSI data output valid after SCK	—	—	—	ns	V_DDIO_(min), C_LOAD = 30 pF_(max)
MSP_13	t_MOH	MOSI hold after SCK	—	1	—	ns
MSP_15	t_MIS	MISO setup time of data input to SCK	—	10	—	ns
MSP_17	t_MIH	MISO hold time of data input to SCK	—	10	—	ns
MSP_19	SPI_GCLK	SERCOM SPI input clk freq, GCLK_SPI	—	—	FCLK_23	MHz	—
Note: Assumes V_DDIOn(min) and a 30 pF external load on all SPIn pins, unless otherwise noted. t_MIS is the master external device setup time.

Figure 3-4. SERCOMn SPI Client Module (CPHA = 0) Timing Diagram

Figure 3-5. SERCOMn SPI Client Module (CPHA = 1) Timing Diagram

Table 3-24. SPIn Module Client Mode Electrical Specifications⁽¹⁾
Standard Operating Conditions: V_DDIO = AVDD = 1.8V to 5.5V (unless otherwise stated) Operating Temperature: -40°C ≤ T_A ≤ +125°C for extended temperature
Param. No.	Symbol	Characteristics⁽¹⁾	Min.	Typ.	Max.	Units	Conditions
SSP_1	f_SCK	SCK frequency	—	—	—	MHz	Receiver mode, C_LOAD = 30 pF_(max)
			—	—	—		Full duplex transmit and receive mode , C_LOAD = 30 pF_(max) Loopback mode with one SPI communicating with another SPI on the same MCU
			—	—	1/(2 × (t_SOV + NOTE2_t_MIS))⁽²⁾		Full duplex transmit and receive mode, C_LOAD = 30 pf_(max). The maximum SPI speed of the MCU is partially dependent on the performance characteristics of the external SPI device. Therefore, faster speeds than the loopback mode described above may be possible using the formula.
SSP_3	t_SCL	SCK output low time	1/(2 x f_SCK)	—	—	µs	—
SSP_5	t_SCH	SCK output high time	1/(2 x f_SCK)	—	—	µs	—
SSP_7	t_SCF	SCK and MOSI output fall time	—	—	DI_27	ns	See parameter DI_27 in the I/O specifications
SSP_9	t_SCR	SCK and MOSI output rise time	—	—	DI_25	ns	See parameter DI_25 in the I/O specifications
SSP_11	t_SOV	MISO data output valid after SCK	—	10	—	ns	V_DD(min), C_LOAD = 30 pF_(max)
SSP_13	t_SOH	MISO hold after SCK	—	13	—	ns
SSP_15	t_SIS	MOSI setup time of data input to SCK	3	—	—	ns
SSP_17	t_SIH	MOSI hold time of data input to SCK	t_{CLK_PER}	—	—	ns
SSP_19	t_SSS	SS setup to SCK (PRELOADEN = `1`)	21	—	—	ns
SSP_19	t_SSS	SS setup to SCK (PRELOADEN = `0`)	21	—	—	ns
SSP_21	t_SSH	SS hold after SCK client	20	—	—	ns
SSP_23	SPI_GCLK	SERCOM SPI input clk freq, GCLK_SPI	—	—	FCLK_23	MHz	—
Note: Assumes V_DDIOn(min) and a 30 pF external load on all SPIn pins unless, otherwise noted. t_MIS is the setup time for the host external device.