1.3.1 Cold Sparing
(Ask a Question)PolarFire SoC devices support cold sparing for GPIO and HSIO. Cold sparing is implemented by connecting the devices as shown in the following figure. The system board has two PolarFire SoC devices in parallel, and the devices share I/Os. The spare device has its HSIO VDDI banks powered-up to prevent I/O leakage through the ESD diodes. As a result, low power and a protected state for the spare device is established. The spare device can be changed to active device by powering-up all the supplies. The active device can be changed to spare device by powering down all the supplies, except HSIO VDDI banks.
A typical cold sparing application integrates two parallel devices with shared I/O connections, as shown in the following figure.
