38.3.6 Thermal Characteristics

Table 38-6.
Standard Operating Conditions (unless otherwise stated)
Param No.	Sym.	Characteristic	Typ.	Units	Conditions
TH01	θ_JA	Thermal Resistance Junction to Ambient	60	°C/W	28-pin SPDIP package
			80	°C/W	28-pin SOIC package
			90	°C/W	28-pin SSOP package
			27.5	°C/W	28-pin UQFN 4x4 mm package
			27.5	°C/W	28-pin QFN 6x6mm package
			47.2	°C/W	40-pin PDIP package
			TBD	°C/W	40-pin UQFN 5x5 package
			46	°C/W	44-pin TQFP package
			24.4	°C/W	44-pin QFN 8x8mm package
TH02	θ_JC	Thermal Resistance Junction to Case	31.4	°C/W	28-pin SPDIP package
			24	°C/W	28-pin SOIC package
			24	°C/W	28-pin SSOP package
			24	°C/W	28-pin UQFN 4x4mm package
			24	°C/W	28-pin QFN 6x6mm package
			24.7	°C/W	40-pin PDIP package
			TBD	°C/W	40-pin UQFN 5x5 package
			14.5	°C/W	44-pin TQFP package
			20	°C/W	44-pin QFN 8x8mm package
TH03	T_JMAX	Maximum Junction Temperature	150	°C
TH04	PD	Power Dissipation	—	W	PD=P_INTERNAL+P_I/O⁽³⁾
TH05	P_INTERNAL	Internal Power Dissipation	—	W	P_INTERNAL=I_DDxV_DD⁽¹⁾
TH06	P_I/O	I/O Power Dissipation	—	W	P_I/O=Σ(I_OLV_OL)+Σ(I_OH(V_DD-V_OH))
TH07	P_DER	Derated Power	—	W	P_DER=PD_MAX (T_J-T_A)/θ_JA⁽²⁾
Note: I_DD is current to run the chip alone without driving any load on the output pins. T_A = Ambient Temperature, T_J = Junction Temperature. See "Absolute Maximum Ratings" for total power dissipation.