2.1 Packages and Pinout

SAM9x5 and SAM9X60 packages differ. SAM9X60 BGA228 is designed to accommodate low-cost 4-layer PCBs when DDR2 is used.

Due to peripheral upgrades, some signals are removed or added in the pinout.

Table 2-1. Packages and Pinout
PeripheralRemoved from SAM9x5Added on SAM9X60
USB

DFSDM/HFSDMA, DFSDP/HFSDPA

HFSDMB, HFSDPB

HFSDMC, HFSDPC

HHSDMC/HHSDPC

SMDDIBN, DIBP–
Boot ROMBMS–
DDRC–DDR_VREF, DDR_CAL
PIO lines–7 IOs (PIOB19 to PIOB25) for extra functions (QSPI, I2SMCC)