1.4 Environmental Compliance
| Parameter | Condition |
|---|---|
| Mechanical Shock | MIL-STD-883 Method 2002 |
| Mechanical Vibration | MIL-STD-883 Method 2007 |
| Temperature Cycle | MIL-STD-883 Method 1010 |
| Solderability | MIL-STD-883 Method 2003 |
| Fine and Gross Leak | MIL-STD-883 Method 1014 |
| Resistance to Solvents | MIL-STD-883 Method 2015 |
| Moisture Sensitivity Level | MSL1 |
| Contact Pads | Gold over Nickel (gold thickness is 0.3 um–1.0 um) |
