Use the multi-layer host board for routing signals on the inner layer and the bottom layer.
The top layer (underneath the module) of the host
board must be ground with as many GND vias as possible, (see the following
figure).
Avoid fan-out of the signals under the module or
antenna area. Use a via to fan-out signals to the edge of the WBZ35x Module.
For a better GND connection to the WBZ35x Module, solder the exposed GND pads of the
WBZ35x Module on the host board.
For the module GND pad, use a GND via of a minimum 10 mil (hole diameter) for good ground to all the layers and thermal conduction path.
The recommendation is to have a series resistor
on the host board for all GPIOs. Place these resistors close to the WBZ35x Module. The following figure illustrates the
placement of the series resistor.
Place the SOSC crystal (32.768 kHz) on the host
board close to the WBZ35x Module and follow the
shortest trace routing length with no vias (see the following figure).Figure 4-8. Example of Host Board on
Top Layer
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