2.4 Temperature Specifications

Table 2-6. 8-Lead TDFN Package Thermal Properties
Parameter	Symbol	Value	Units	Condition
Junction to Ambient Thermal Resistance	Ɵ_JA	122.9	°C/W	Still air
		115.1	°C/W	1 m/s airflow
		111.1	°C/W	2.5 m/s airflow
Junction to Board Thermal Resistance	Ɵ_JB	65.8	°C/W	—
Junction to Case Thermal Resistance	Ɵ_JC	129.2	°C/W	—
Thermal Characterization, Junction to Top of Package	Ψ_JT	10.5	°C/W	Still air

DS20007045B

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