36.9 Thermal Specifications
Symbol | Description | Typ. | Unit | Conditions |
---|---|---|---|---|
θJA | Thermal Resistance Junction to Ambient | 62 | °C/W | 14-pin SOIC (SL) |
75 | °C/W | 20-pin SSOP (SS) | ||
53 | °C/W | 20-pin VQFN (REB) | ||
50 | °C/W | 28-pin SPDIP package (SP) | ||
47 | °C/W | 28-pin SSOP (SS) | ||
36 | °C/W | 28-pin VQFN (STX) | ||
57 | °C/W | 32-pin TQFP package (PT) | ||
33 | °C/W | 32-pin VQFN package (RXB) | ||
TJMAX | Maximum Junction Temperature | Refer to the Absolute Maximum Ratings section | ||
Note:
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