8.2 Electrical Specification

Stresses beyond those listed in this chapter may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these or any other conditions beyond those indicated in the operational chapters of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Table 8-1. Absolute Maximum Ratings
Parameter	Rating	Units
Ambient temperature under bias	-40 to +85	°C
Storage temperature	-65 to +150	°C
Voltage on Pins with Respect to GND
On the V_DD pin	-0.3 to +5.5	V
On the V_USB pin	-0.3 to V_DD	V
On the V_BUS pin	-0.3 to V_DD	V
On the RESET pin	-0.3 to +5.5	V
On all other pins	-0.3 to (V_DD + 0.3)	V
Maximum Current
On the GND pin ⁽¹⁾	350	mA
On the V_DD ⁽¹⁾ pin	350	mA
On any standard I/O pin	±50	mA
Clamp current, I_K (V_PIN < 0 or V_PIN >V_DD)	±20	mA
Total power dissipation ⁽²⁾	800	mW
Note: The maximum current rating requires an even load distribution across the I/O pins. The device package's power dissipation characteristics may limit the maximum current rating. Refer to the Thermal Specifications section to calculate the device specifications. Power dissipation is calculated as follows: P_DIS = V_DD × {I_DD - Σ I_OH} + Σ {(V_DD - V_OH) × I_OH} + Σ (V_OI × I_OL)