60 Schematic Checklist

Introduction

This chapter describes a common checklist that must be used when starting and reviewing the schematics for a PIC32CZ CA design. This chapter illustrates the recommended power supply connections, and how to connect the external analog references, programmer, and debugger.

Note:
  1. Supplies Power-up and Power-Down considerations refers to sections 7, 8.1, and 8.2.
  2. All capacitors are ceramic w/ESR < 1Ω.
  3. Package PAD must be soldered to ground with multiple vias to ground PCB layer (See suggested PAD landing pattern).
  4. In the case of packages with leads, all decoupling capacitors should be placed on the same side of the PCB as the MCU and as close to the pins as possible. In the case of BGA packages, all decoupling capacitors should be placed on the opposite side of the PCB from the MCU with minimal distance between the ball and the associated capacitor.
  5. In the case where the USB is not being used in the application, the VUSB3V3 pins should be connected to ground.
  6. In the case where the JTAG will be the primary debugging interface during development or in the case that boundary scan will be implemented in manufacturing, use of any alternative functions on the TMS, TDO, TDI, and TCK pins should be avoided.
  7. In the case that trace functions are implemented, the ability to isolate these signals from any alternative functions during development is recommended.
  8. All ground connections should be made to the ground plane PCB layer with the shortest possible fan out.
  9. Optionally, a dual supply can be implemented by leaving the VDDOUT pin unconnected and substituting an external power rail for VDDOUT between 1.08 and 1.32V.