2.4 Temperature Specifications


Parameters	Sym.	Min.	Typ.	Max.	Units	Conditions
Storage Temperature	T_S	–65	—	+150	°C	—
Junction Temperature	T_J	–40	—	+125	°C	—
Lead Temperature	T_LEAD	—	260	—	°C	Soldering, 10 seconds
Power Dissipation	P_D	—	—	(T_J(max) – T_A) / θ_JA	°C/W	Internally limited. See Note 1 below.
Package Thermal Resistance, 28-pin VQFN	θ_JA	—	24	—	°C/W	—
Note: The maximum allowable power dissipation of any T_A (ambient temperature) is P_D(max) = (T_J(max) – T_A) / θ_JA. Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the regulator will go into thermal shutdown.