59.3.4 64-Pin VQFN

Note: The exposed die attach pad is not connected electrically inside the device. It is recommended that the exposed pad be connected to ground in the PCB.

Table 59-8. Device and Package Maximum Weight
200	mg

Table 59-9. Package Characteristics
Moisture Sensitivity Level	MSL3

Table 59-10. Package Reference
JEDEC Drawing Reference	MO-220
JESD97 Classification	E3

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