3.1.2 DC Characteristics

Table 3-3. POR Electrical Characteristics

DC CHARACTERISTICS

Standard Operating Conditions: 2.97V to 3.63V (Unless Otherwise Stated)

Operating Temperature: -40°C ≤ TA ≤ +85°C

Parameter No.SymbolCharacteristicsMin.Typ.Max.UnitsConditions
DC16VPORVDD start voltage to ensure internal POR signal1.5——V—
DC17SVDD

VDD rise rate to ensure internal POR signal

0.03—0.115V/ms110-28.7 ms at 3.3V
Table 3-4. BOR Electrical Characteristics

DC CHARACTERISTICS

Standard Operating Conditions: 2.97V to 3.63V (Unless Otherwise Stated)

Operating Temperature: -40°C ≤ TA ≤ +85°C

Parameter No.SymbolCharacteristicsMin.(1)Typ.Max.UnitsConditions
BO10VBORBOR event on VDD transition high-to-low(2)2.6—2.8V—
Note:
  1. Parameters are for design guidance only and are not tested in manufacturing.
  2. Overall functional device operation at VBORMIN < VDD < VDDMIN is tested but not characterized. All device Analog modules, such as ADC and more, are going to function but with degraded performance below VDDMIN.
Table 3-5. Operating Current (IDD, RF = OFF)(1)(2)

DC CHARACTERISTICS

Standard Operating Conditions: 2.97V to 3.63V (Unless Otherwise Stated)

Operating Temperature: -40°C ≤ TA ≤ +85ºC

Parameter No.Typ.(1)Max.UnitsConditions
I/O Operating Current (IDD): Peripheral Enabled (PMDx = 0)
DC2623.6—mA200 MHz
Note:

  1. Data in the Typical column is at 3.3V, 25°C unless otherwise stated.

Table 3-6. Power-Down Current (IPD)
DC CHARACTERISTICS(3)

Standard Operating Conditions:2.97V to 3.63V (Unless Otherwise Stated)

Operating Temperature: -40°C ≤ TA ≤ +85ºC

Parameter No.Typ.(1)Max.UnitsConditions
Power-Down Current (IPD)
DC40s1.7—μA-40°CExtreme Sleep mode(2)
DC40t0.71—μA25°C
DC40u2.12—μA85°C
Module Differential Current
DC42e70—μA3.3V
  • RTCC+ Timer1 with 32 kHz
  • Crystal: ΔIRTCC
DC43d120—μA3.3VADC: ΔIADC
Note:

  1. Data in the Typical column is at 3.3V, Ta = 25°C unless otherwise stated.

  2. All subsystems disabled except WAKE pin.
  3. This parameter is characterized but not tested in manufacturing.
Table 3-7. I/O Pin Input Specifications
DC CHARACTERISTICSStandard Operating Conditions: 2.97V to 3.63V (Unless Otherwise Stated)

Operating Temperature: -40°C ≤ TA ≤ +85°C

Parameter No.SymbolCharacteristicsMin.Typ.(1)Max.UnitsConditions
—VILInput low voltage —————
DI10I/O pinsVSS—0.2* VDDV—
DI18

SDAx, SCLx

VSS—0.3* VDDVSMBus disabled(4)
DI19SDAx, SCLxVSS—

0.8

VSMBus enabled(4)
DI20VIHInput high voltage————(4)
I/O pins0.80* VDD—VDDV
DI30ICNPUChange notification pull-up current——-40µA
  • VDD = 3.3V
  • VPIN = VSS(3)
DI50IILInput leakage current(3)—————
I/O ports—±1µA

VSS ≤ VPIN ≤ VDD,

Pin at high-impedance

DI51Analog input pins—±1µA

VSS ≤ VPIN ≤ VDD,

Pin at high-impedance

DI55MCLR(2)—±1µA

VSS ≤ VPIN ≤ VDD

DI56XTAL_IN—±1µA

VSS ≤ VPIN ≤ VDD,

HS mode

Note:

  1. Data in the Typ. column is at 3.3V, +25°C unless otherwise stated.

  2. The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages.

  3. Negative current is defined as current sourced by the pin.

  4. This parameter is characterized but not tested in manufacturing.

Table 3-8. I/O Pin Output Specifications

DC CHARACTERISTICS

Standard Operating Conditions: 2.97V to 3.63V (Unless Otherwise Stated)

Operating Temperature: -40°C ≤ TA ≤ +85ºC

Parameter No.SymbolCharacteristicMin.Typ.Max.UnitsConditions(1)
DO10VOL

Output low voltage I/O pins:

4xsink driver pins - RA4, RA5, RA10, RA13, RA14, RB4-RB7, RB9, RB12, RC9-RC12, RK1, RK4-RK7, RK12

——0.4VIOL ≤ 10 mA, VDD = 3.3V

Output low voltage I/O pins:

8x sink driver pins - RA0, RA1, RA11, RC0, RC8, RC9, RC13-RC15, RK13, RK14

——0.4

V

IOL ≤ 15 mA, VDD = 3.3V

DO20VOH

Output high voltage I/O pins: 4xsource driver pins -

RA4, RA5, RA10, RA13, RA14, RB4-RB7, RB9, RB12, RC9-RC12, RK1, RK4-RK7, RK12

2.4——VIOH ≥ -10 mA, VDD = 3.3V

Output high voltage I/O pins:

8x source driver pins - RA1, RC8, RC9, RC13, RC14, RC15, RK13, RK14

2.4——VIOH ≥ -15 mA, VDD = 3.3V
DO20aVOH1

Output high voltage I/O pins:

4xsource driver pins -

RA4, RA5, RA10, RA13, RA14, RB4-RB7, RB9, RB12, RC9-RC12, RK1, RK4-RK7, RK12		1.5——VIOH ≥-14 mA, VDD = 3.3V
2.0——VIOH ≥ -12 mA, VDD = 3.3V
3.0——VIOH ≥ -7 mA, VDD = 3.3V

Output high voltage I/O pins:

8x source driver pins - RA1, RC8, RC9, RC13, RC14, RC15, RK13, RK14

1.5——VIOH ≥ -22 mA, VDD = 3.3V
2.0——VIOH ≥ -18 mA, VDD = 3.3V
3.0——VIOH ≥ -10 mA, VDD = 3.3V
Note: These parameters are characterized but not tested in manufacturing.
Table 3-9. Wi-Fi® Current
DC CharacteristicsStandard Operating Conditions: 3.0-3.6V

(Unless Otherwise Stated)

Operating Temperature: -40°C ≤ TA ≤ +85°C

Device StatesCode Rate(6)Output Power (Typ.) (dBm)Current (Typ.) (mA)(3)
On_Transmit(4)802.11b 1 Mbps(5)20.5293
802.11b 1 Mbps14.5212
802.11b 11 Mbps(5)20.5293
802.11g 6 Mbps19.5272
802.11g 54 Mbps(5)18.5241
802.11n MCS018.5258
802.11n MCS7(5)17.0223
802.11n MCS711.0179
On_Receive802.11b 1 Mbps—75
802.11n MCS7(5)—89.5
Note:
  1. Measured along with the RF matching network and FEM circuit (assume 50W impedance).
  2. The test conditions for IDD measurements are as follows:
    • CPU, Flash Panel and SRAM data memory are operational
    • CPU is operating at 50 MHz
    • CPU is in Wi-Fi® RF Test mode
    • All peripheral modules are disabled (ON bit = 0) but the associated PMD bit is cleared
    • Watchdog and fail safe clock monitor disabled
    • All I/O pins are configured as inputs and pulled to VDD
    • VBUS3V3 connected to VDD
    • MCLR = VDD
  3. Data in the Typ. column is at 3.3V, 25°C unless otherwise stated.
  4. Tested at channel 7 in Fixed Mode Gain.
  5. This parameter is characterized and tested in manufacturing.
  6. This parameter is characterized but not tested in manufacturing.