3.1.1 Absolute Maximum Ratings

Exposure to these maximum rating conditions for extended periods may affect device reliability. Functional operation of the device at these or any other conditions, above the parameters indicated in the operation listings of this specification, is not implied. The following table details about the absolute maximum ratings of the RNWF11 Module.
Table 3-1. Absolute Maximum Ratings
ParameterValue
Ambient temperature under bias-40°C to +85ºC
Storage temperature-40°C to +125°C
Voltage on VDD with respect to GND0.3V to (VDD + 0.3V)
Voltage on VBUS with respect to GND

0.3V to (VDD + 0.3V)

Maximum current out of GND pin(s) 500 mA
Maximum current into VDD pin(s)(2)500 mA
Maximum current sunk/sourced by any 4x I/O pin(3) 15 mA
Maximum current sunk/sourced by any 8x I/O pin(3)25 mA
Maximum current sunk by all ports 150 mA
Maximum current sourced by all ports(2)150 mA
ESD Qualification
Human Body Model (HBM) per JEDEC JS-001-2017±2000V
Charged Device Model (CDM) (JEDEC JS-002-2018)±500V
Note:
  1. The stresses mentioned in this table can cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions, above those indicated in the operation listings of this specification, is not implied. Exposure to maximum rating conditions for extended periods can affect device reliability.
  2. The maximum allowable current is a function of the device’s maximum power dissipation.
  3. Characterized, but not tested. For the 4x and 8x I/O pin lists, refer to the parameters DO10 and DO20.
Table 3-2. Recommended Operating Conditions

Symbol

Parameter

Min.

Typ.

Max.

Unit

VDDPower supply input voltage3.03.3

3.6

V