41.1 Absolute Maximum Ratings(†)
Parameter | Rating | ||
---|---|---|---|
Ambient temperature under bias | -40°C to +125°C | ||
Storage temperature | -65°C to +150°C | ||
Voltage on pins with respect to VSS | |||
| -0.3V to +6.5V | ||
| -0.3V to +9.0V | ||
| -0.3V to (VDD + 0.3V) | ||
Maximum current(1) | |||
| -40°C ≤ TA ≤ +85°C | 300 mA | |
85°C < TA ≤ +125°C | 120 mA | ||
| -40°C ≤ TA ≤ +85°C | 250 mA | |
85°C < TA ≤ +125°C | 85 mA | ||
| ±25 mA | ||
Clamp current, IK (VPIN < 0 or VPIN > VDD) | ±20 mA | ||
Total power dissipation(2) | 800 mW |
Note:
- Maximum current rating requires even load distribution across I/O pins. Maximum current rating may be limited by the device package power dissipation characterizations, see the “Thermal Characteristics” section to calculate device specifications.
- Power dissipation is calculated as follows:
- Internal Power Dissipation is calculated as follows: where IDD is current to run the chip alone without driving any load on the output pins.
- I/O Power Dissipation is calculated as follows:
- Derated Power is calculated as follows: where TA = Ambient Temperature, TJ = Junction Temperature.
: Stresses above those listed
under the “Absolute Maximum Ratings” section may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any
other conditions above those indicated in the operation listings of this specification is
not implied. Exposure above maximum rating conditions for extended periods may affect
device reliability.