3 Signal Description

Table 3-1. Signal Description List
Signal NameFunctionTypeActive LevelVoltage referenceComments
Power Supplies
VDDIO3.3V Digital supply Power3.0V to 3.6V (1)
VDDIN3.3V Voltage input for core voltage regulatorPower3.0V to 3.6V (1)
VDDIN_AN3.3V Analog supply (ADC + PGA) Power3.0V to 3.6V (2)
VDDCORE1.25V Voltage Regulator Output with internal connection to Core power supply Power1.25V (3)
VDDPLL1.25V PLL power supply input. Must be connected to VDDCORE through a LP filter Power1.25V (4)
VREGPPLC Driver voltage regulator output for external decoupling capacitorPower(5)
VREGNPLC Driver voltage regulator output for external decoupling capacitorPower(6)
PVDDAMPPower supply of PLC driver amplifier and regulatorsPower8V to 16V (7)(8)
VDDAMP3.3V Digital and analog power supply of PLC driverPower3.0 to 3.6V (9)
GND Digital groundPower(10)
AGNDAnalog groundPower(10)
PGNDPower ground of PLC driverPower(10)
GNDAMPAnalog ground of PLC driverPower(10)
Clocks, Oscillators and PLLs
XINCrystal Oscillator InputInputVDDIO
XOUTCrystal Oscillator OutputOutputVDDIO
Reset/Enable
NRSTSystem ResetInputLowVDDIO(11)
ENABLEEnable Internal core voltage regulatorInputHighVDDIO
Power Line Communications
OUTSwitching amplifier outputOutputPVDDAMP
ASO[0:1]Analog Switch Outputs to disable the bandpass filtering when there is no PLC transmission activityOutputPVDDAMPHigh-voltage, high-current and low resistance analog switches.
ASI[0:1]Analog Switch statusOutputVDDIO
VINPLC signal reception inputInputVDDIN_AN
AGC

Automatic Gain Control. This digital tri-state output is managed by AGC hardware logic to drive external circuitry when input signal attenuation is needed

OutputVDDIO(12)
VZC Mains Zero-Cross Detection Signal. This input detects the zero-crossing of the mains voltageInputVDDIOExternal Protection Resistor (12), (13)
VREFPInternal Reference “Plus” Voltage AnalogVDDIN_AN(14)
VREFNInternal Reference “Minus” Voltage AnalogVDDIN_AN(14)
VREFCInternal Reference Common-mode Voltage AnalogVDDIN_AN(15)
EMIT[2:3] PLC Tri-state Transmission portsOutputVDDIO
TXRX1

Analog Front-End Transmission/Reception for the auxiliary transmission branch. This digital output is used to modify external coupling behavior in Transmission/Reception

OutputVDDIO
Input/Output
STBYEnable Sleep mode of the modemInputHighVDDIO(16)
EXTINIndication of pending eventsOutputLowVDDIO
TXENTransmission enabledInputHighVDDIO
Thermal Monitor
THENEnable Thermal Monitor functionalityInputHighVDDIO
NTHW0Indication of the first thermal warningOutputVDDIO
THW1Indication of the second thermal warningOutputVDDIO
G1General Purpose InputInputHighVDDIO
Serial Peripheral Interface - SPI
CSSPI Chip SelectInputLowVDDIOInternal pull up (17)
SCKSPI Clock signalInputVDDIOInternal pull up (17)
MOSISPI Host Out Client InInputVDDIOInternal pull up (17)
MISOSPI Host In Client OutOutputVDDIO
Notes:
  1. Connecting two 100 nF decoupling multilayer ceramic capacitors (MLCC) to the VDDIO and VDDIN pins is recommended. In addition, for correct PLC transmission using the auxiliary branch, placing one 4.7 μF decoupling multilayer ceramic capacitor (MLCC) as close as possible to VDDIO pins D1 and D3 is strongly recommended.
  2. Placing a 100 nF decoupling multilayer ceramic capacitor (MLCC) in the VDDIN_AN pins is recommended.
  3. Placing 100 nF plus 2.2 μF decoupling multilayer ceramic capacitors (MLCC) in each pair of VDDCORE pins (H5-J5 and C1-C2) is recommended.
  4. Placing 100 nF plus 4.7 μF decoupling multilayer ceramic capacitors (MLCC) in the VDDPLL pin is recommended.
  5. A 100 nF multilayer ceramic capacitor (MLCC) is required between the ‘VREGP’ and ‘PVDDAMP’ pads for decoupling and stabilization purposes.
  6. A 100 nF multilayer ceramic capacitor (MLCC) is required between the ‘VREGN’ and ‘GNDAMP’ pads for decoupling and stabilization purposes.
  7. Placing one 100 uF aluminum Low-ESR 25V capacitor and three 100 nF 25V multilayer ceramic capacitors (MLCC) in the PVDDAMP pins is recommended.
  8. The PLC-protocol firmwares provided by Microchip are configured by default for a power supply of the PLC driver amplifier of 12V.
  9. Placing a 100 nF decoupling multilayer ceramic capacitor (MLCC) in the VDDAMP pins is recommended.
  10. Separate pins are provided for GND, AGND, PGND and GNDAMP grounds. Taking these layout considerations into account to reduce interference is recommended. It is recommended to connect ground pins as short as possible to the system ground plane. For more details about EMC Considerations, refer to AVR040 Application Note.
  11. It is recommended to connect the NRST signal to a GPIO in the host controller with an internal pull-down default reset configuration to help keep PL460 in reset until the host boots. For more details, refer to Reset (NRST) Pin
  12. See Table 11-4.
  13. VZC is not isolated; some isolation circuitry is required in case of using a non-isolated design. Refer to the Reference Design for further information.
  14. Bypass to analog ground with an external 22 nF decoupling capacitor and connect an external 10 nF decoupling capacitor between VREFP and VREFN.
  15. Bypass to analog ground with an external 10 nF decoupling capacitor.
  16. The STBY signal must be connected to GND if the Sleep mode functionality is not used. If using the Sleep mode functionality, the STBY signal must be connected to a GPIO in the host controller with an internal pull-down default reset configuration to avoid enabling Sleep mode until the host boots. For more details, refer to Standby (STBY) Pin
  17. See Table 11-5.