3 Signal Description

Table 3-1. Signal Description List
Signal Name Function Type Active Level Voltage reference Comments
Power Supplies
VDDIO 3.3V Digital supply Power 3.0V to 3.6V (1)
VDDIN 3.3V Voltage input for core voltage regulator Power 3.0V to 3.6V (1)
VDDIN_AN 3.3V Analog supply (ADC + PGA) Power 3.0V to 3.6V (2)
VDDCORE 1.25V Voltage Regulator Output with internal connection to Core power supply Power 1.25V (3)
VDDPLL 1.25V PLL power supply input. Must be connected to VDDCORE through a LP filter Power 1.25V (4)
VREGP PLC Driver voltage regulator output for external decoupling capacitor Power (5)
VREGN PLC Driver voltage regulator output for external decoupling capacitor Power (6)
PVDDAMP Power supply of PLC driver amplifier and regulators Power 8V to 16V (7)(8)
VDDAMP 3.3V Digital and analog power supply of PLC driver Power 3.0 to 3.6V (9)
GND Digital ground Power (10)
AGND Analog ground Power (10)
PGND Power ground of PLC driver Power (10)
GNDAMP Analog ground of PLC driver Power (10)
Clocks, Oscillators and PLLs
XIN Crystal Oscillator Input Input VDDIO
XOUT Crystal Oscillator Output Output VDDIO
Reset/Enable
NRST System Reset Input Low VDDIO (11)
ENABLE Enable Internal core voltage regulator Input High VDDIO
Power Line Communications
OUT Switching amplifier output Output PVDDAMP
ASO[0:1] Analog Switch Outputs to disable the bandpass filtering when there is no PLC transmission activity Output PVDDAMP High-voltage, high-current and low resistance analog switches.
ASI[0:1] Analog Switch status Output VDDIO
VIN PLC signal reception input Input VDDIN_AN
AGC

Automatic Gain Control. This digital tri-state output is managed by AGC hardware logic to drive external circuitry when input signal attenuation is needed

Output VDDIO (12)
VZC Mains Zero-Cross Detection Signal. This input detects the zero-crossing of the mains voltage Input VDDIO External Protection Resistor (12), (13)
VREFP Internal Reference “Plus” Voltage Analog VDDIN_AN (14)
VREFN Internal Reference “Minus” Voltage Analog VDDIN_AN (14)
VREFC Internal Reference Common-mode Voltage Analog VDDIN_AN (15)
EMIT[2:3] PLC Tri-state Transmission ports Output VDDIO
TXRX1

Analog Front-End Transmission/Reception for the auxiliary transmission branch. This digital output is used to modify external coupling behavior in Transmission/Reception

Output VDDIO
Input/Output
STBY Enable Sleep mode of the modem Input High VDDIO (16)
EXTIN Indication of pending events Output Low VDDIO
TXEN Transmission enabled Input High VDDIO
Thermal Monitor
THEN Enable Thermal Monitor functionality Input High VDDIO
NTHW0 Indication of the first thermal warning Output VDDIO
THW1 Indication of the second thermal warning Output VDDIO
G1 General Purpose Input Input High VDDIO
Serial Peripheral Interface - SPI
CS SPI Chip Select Input Low VDDIO Internal pull up (17)
SCK SPI Clock signal Input VDDIO Internal pull up (17)
MOSI SPI Host Out Client In Input VDDIO Internal pull up (17)
MISO SPI Host In Client Out Output VDDIO
Notes:
  1. Connecting two 100 nF decoupling multilayer ceramic capacitors (MLCC) to the VDDIO and VDDIN pins is recommended. In addition, for correct PLC transmission using the auxiliary branch, placing one 4.7 μF decoupling multilayer ceramic capacitor (MLCC) as close as possible to VDDIO pins D1 and D3 is strongly recommended.
  2. Placing a 100 nF decoupling multilayer ceramic capacitor (MLCC) in the VDDIN_AN pins is recommended.
  3. Placing 100 nF plus 2.2 μF decoupling multilayer ceramic capacitors (MLCC) in each pair of VDDCORE pins (H5-J5 and C1-C2) is recommended.
  4. Placing 100 nF plus 4.7 μF decoupling multilayer ceramic capacitors (MLCC) in the VDDPLL pin is recommended.
  5. A 100 nF multilayer ceramic capacitor (MLCC) is required between the ‘VREGP’ and ‘PVDDAMP’ pads for decoupling and stabilization purposes.
  6. A 100 nF multilayer ceramic capacitor (MLCC) is required between the ‘VREGN’ and ‘GNDAMP’ pads for decoupling and stabilization purposes.
  7. Placing one 100 uF aluminum Low-ESR 25V capacitor and three 100 nF 25V multilayer ceramic capacitors (MLCC) in the PVDDAMP pins is recommended.
  8. The PLC-protocol firmwares provided by Microchip are configured by default for a power supply of the PLC driver amplifier of 12V.
  9. Placing a 100 nF decoupling multilayer ceramic capacitor (MLCC) in the VDDAMP pins is recommended.
  10. Separate pins are provided for GND, AGND, PGND and GNDAMP grounds. Taking these layout considerations into account to reduce interference is recommended. It is recommended to connect ground pins as short as possible to the system ground plane. For more details about EMC Considerations, refer to AVR040 Application Note.
  11. It is recommended to connect the NRST signal to a GPIO in the host controller with an internal pull-down default reset configuration to help keep PL460 in reset until the host boots. For more details, refer to 6.1 Reset (NRST) Pin
  12. See Table 11-4.
  13. VZC is not isolated; some isolation circuitry is required in case of using a non-isolated design. Refer to the Reference Design for further information.
  14. Bypass to analog ground with an external 22 nF decoupling capacitor and connect an external 10 nF decoupling capacitor between VREFP and VREFN.
  15. Bypass to analog ground with an external 10 nF decoupling capacitor.
  16. The STBY signal must be connected to GND if the Sleep mode functionality is not used. If using the Sleep mode functionality, the STBY signal must be connected to a GPIO in the host controller with an internal pull-down default reset configuration to avoid enabling Sleep mode until the host boots. For more details, refer to 6.3 Standby (STBY) Pin
  17. See Table 11-5.