Use the multi-layer host board for routing signals on the inner layer and the
bottom layer.
The top layer (underneath the
Module) of the host board must be ground with as many GND vias as possible as
shown in the following figure.
Avoid fan-out of the signals
under the Module or antenna area. Use a via to fan-out signals to the edge of
the PIC32WM-BW1 Module.
For a better GND connection to
the PIC32WM-BW1 Module, solder the exposed
GND pads of the Module on the host board.
For the Module GND pad, use a GND
via of a minimum 10 mil (hole diameter) for good ground to all the layers and
thermal conduction path.
Having a series resistor on the
host board for all reserved pins and digital interface pins is recommended.
These resistors must be placed close to the PIC32WM-BW1 Module. The following figure illustrates the placement of
the series resistor.
The RTCC Oscillator (32.768 kHz)
on the host board must be placed close to the PIC32WM-BW1 Module and follow the shortest trace routing length with
no vias. The following figure illustrates the example of host board on top
layer.
Figure 2-14. Host Board on Top Layer
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