The PIC32WM-BW1 Module can be placed anywhere on
the host-board as shown in the following figure.
Exposed GND pads on the bottom of
the PIC32WM-BW1 Module must be soldered to
the host board.
A low-impedance ground plane for
the PIC32WM-BW1 Module ensures the best
radio performance (best range and lowest noise). The ground plane can be
extended beyond the minimum recommendation as required for the host board EMC
and noise reduction.
A PCB cutout or a copper keep out is required under the RF test point.
Copper keep out areas are required on the top layer under voltage test
points.
Alternatively, the entire region, except the exposed ground paddle, can be
solder-masked.
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