2.4 PIC32WM-BW1 Module Placement Guidelines

  • The PIC32WM-BW1 Module can be placed anywhere on the host-board as shown in the following figure.
  • Exposed GND pads on the bottom of the PIC32WM-BW1 Module must be soldered to the host board.
  • A low-impedance ground plane for the PIC32WM-BW1 Module ensures the best radio performance (best range and lowest noise). The ground plane can be extended beyond the minimum recommendation as required for the host board EMC and noise reduction.
  • A PCB cutout or a copper keep out is required under the RF test point.
  • Copper keep out areas are required on the top layer under voltage test points.
  • Alternatively, the entire region, except the exposed ground paddle, can be solder-masked.
Figure 2-13. PIC32WM-BW1002UC Module Placement (Top View)