39.10.1 Internal Oscillators

Table 39-9. Internal Oscillator Specifications(1)
SymbolDescriptionMin.Typ. ✝Max.UnitConditions
fOSCHFOSCHF frequency—

1(2)

2(2)

3(2)

—MHz

fOSCHF < 4MHz

1 MHz: ±10%, -40°C ≤ TA ≤ +125°C

2 MHz: ±8%, -40°C ≤ TA ≤ +125°C

3 MHz: ±6%, -40°C ≤T A ≤ +125°C

Precision calibrated OSCHF frequency—

4

8

12

16

20

24

—
%CALOSCHF tune step size—0.4—%
tOSCHF_ST(3)OSCHF wake-up from sleep start-up time—2430μs

Device in Idle or Standby sleep mode,

VREGCTRL.PMODE = FULL

—220600μs

Device in Power-Down sleep mode,

VREGCTRL.PMODE = AUTO

fOSC32KInternal OSC32K frequency29.49132.76836.045kHz
tOSC32K_ST(3)OSC32K wake-up from sleep start-up time—9501000μs

Device in Power-Down sleep mode,

VREGCTRL.PMODE = AUTO

✝ Data found in the “Typ.” column is at TA = 25°C and VDD = 3.0V unless otherwise specified. These parameters are for design guidance only and are not tested.

Note:
  1. To ensure these oscillator frequency tolerances, VDD and GND must be capacitively decoupled as close to the device as possible. See the Connection for Power Supply section of the Hardware Guidelines section for details.
  2. These parameters are not calibrated.
  3. Wake-up times are measured from the wake-up event to code execution.
Figure 39-2. Precision Calibrated OSCHF (fOSCHF ≥ 4 MHz) Frequency Accuracy Over Device VDD and Temperature(1)
Note: The figure is applicable only for fOSCHF ≥ 4 MHz.