39.10.1 Internal Oscillators

Table 39-9. Internal Oscillator Specifications(1)
Symbol Description Min. Typ. ✝ Max. Unit Conditions
fOSCHF OSCHF frequency —

1(2)

2(2)

3(2)

 — MHz

fOSCHF < 4MHz

1 MHz: ±10%, -40°C ≤ TA ≤ +125°C

2 MHz: ±8%, -40°C ≤ TA ≤ +125°C

3 MHz: ±6%, -40°C ≤T A ≤ +125°C
Precision calibrated OSCHF frequency —

4

8

12

16

20

24

 —
%CAL OSCHF tune step size — 0.4 — %
tOSCHF_ST(3) OSCHF wake-up from sleep start-up time — 24 30 μs

Device in Idle or Standby sleep mode,

VREGCTRL.PMODE = FULL
— 220 600 μs

Device in Power-Down sleep mode,

VREGCTRL.PMODE = AUTO
fOSC32K Internal OSC32K frequency 29.491 32.768 36.045 kHz
tOSC32K_ST(3) OSC32K wake-up from sleep start-up time — 950 1000 μs

Device in Power-Down sleep mode,

VREGCTRL.PMODE = AUTO

✝ Data found in the “Typ.” column is at TA = 25°C and VDD = 3.0V unless otherwise specified. These parameters are for design guidance only and are not tested.

Note:
  1. To ensure these oscillator frequency tolerances, VDD and GND must be capacitively decoupled as close to the device as possible. See the Connection for Power Supply section of the Hardware Guidelines section for details.
  2. These parameters are not calibrated.
  3. Wake-up times are measured from the wake-up event to code execution.
Figure 39-2. Precision Calibrated OSCHF (fOSCHF ≥ 4 MHz) Frequency Accuracy Over Device VDD and Temperature(1)
Note: The figure is applicable only for fOSCHF ≥ 4 MHz.