1.7.1 Description

The following list provides the description of character codes:

• Device Name (M2XXXX)

  M2GL is used for IGLOO 2 Devices, for example: M2GL050TS

• Package (PK###): Available Package
  • PK: Package code¹
    • FG(G): Fine Pitch BGA, 1.00 mm pitch
    • FC(G): Flip Chip Fine Pitch BGA with Metal LID on top, 1.00 mm pitch
    • FCV(G): Flip Chip Very Fine Pitch BGA with Metal LID on top, 0.8 mm pitch
    • FCS(G): Flip Chip Ultra Fine Pitch BGA with Metal LID on top, 0.5 mm pitch
    • VF(G): Very Fine Pitch BGA, 0.8 mm pitch
    • TQ(G): Ultra Fine Pitch Thin Quad Flat Pack Package, 0.5 mm pitch
  • ###: Number of Pins: Can be three or four digits. For example, 144, 256, or 1152.
• Wafer Lot (AAAAAASSX): Microchip wafer lot number
  • AAAAAA: Wafer lot number
  • SS: Two blank spaces
  • X: One digit die revision code
• Speed Grade (-###): Speed Binning Number
  • Blank: Standard speed grade
  • –1: –1 Speed grade
• Product grade (Z): Product Grade

  The following list provides the product grades:

  • Blank/C: Commercial
  • ES: Engineering Samples
  • I: Industrial
  • M: Military Temperature
  • PP: Pre-Production
  • T1: AEC-Q100 Automotive Grade 1
  • T2: AEC-Q100 Automotive Grade 2
• Date Code (YYWWSS%): Assembly Date Code
  • YY: Last two digits for seal year
  • WW: Work week the part was sealed
  • SS: Two blank spaces
  • %: Can be digital number or character for new product
• Customer Type Number: As specified on the lot traveler
  • GW: Gold Wire bond
• Part number Prefix: Part number prefix

  The following list describes different part number prefixes:

  • Blank: Design Security
  • T: Transceivers and Design Security
  • S: Design and Data Security
  • TS: Transceiver, Design, and Data Security
• Country of Origin (CCD): Assembly house country location
  • Country name: Country Code
  • China: CHN
  • Hong Kong: HKG
  • Japan: JPN
  • Korea,South: KOR
  • Philippines: PHL
  • Taiwan: TWN
  • Singapore: SGP
  • United States: USA
  • Malaysia: MYS