2.2 Layout

The following figure shows the top layer of the ATA8352 module with the routing of the RF path and GND routing of the ATA8352 device with the blocking capacitors. The structure connection between the PCB and SMA connector contains a 30 to 50Ω convertor. The recommended guidelines are:

  1. Use the same structure and follow the GND connection, as shown in the ATA8352 device layout and the capacitors to achieve the required sensitivity level. The layout shown in the following figure is designed in such a way to avoid loop connections for the power and ground supplies.
    Figure 2-3. ATA8352 – Top Layer and Components
  2. Place three vias below the ATA8352 device for the GND connection.
  3. Place a short and straight connection for the RF path to the SMA connector and copy the 30 to 50Ω conversion.
    The following figure illustrates the module footprint.
    Figure 2-4. ATA8352 Module Footprint (dimension in mm)