2.1 Absolute Maximum Ratings


Parameters	Symbol	Min.	Max.	Unit
High-Side Floating Supply Voltage	V_B	−0.3	624	V
High-Side Floating Supply Offset Voltage	V_S	V_B − 24	V_B + 0.3	V
High-Side Floating Output Voltage	V_HO	V_S − 0.3	V_B + 0.3	V
Offset Supply Voltage Transient	dV_S/dt	—	50	V/ns
Low-Side Fixed Supply Voltage	V_CC	−0.3	24.0	V
Low-Side Output Voltage	V_LO	−0.3	V_CC + 0.3	V
Logic Input Voltage (HIN, LIN, ITRIP, EN and FO*)	V_IN	−0.3	5.5	V
SOIC-28 Package Power Dissipation @ T_A ≤ 25°C	P_D	—	2.3	W
SOIC-28 Thermal Resistance (See Note)	θ_JC	—	45	°C/W
SOIC-28 Thermal Resistance (See Note)	θ_JA	—	60	°C/W
Junction Operating Temperature	T_J	—	150	°C
Lead Temperature (Soldering 10s)	T_L	—	300	°C
Storage Temperature	T_stg	−55	150	°C

Warning: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability.

Note: Thermal resistance and power dissipation ratings are measured while board-mounted and under still air conditions.