10.3 Package Details

The following figures illustrate the footprint dimensions and the chip outline details of the IS2008S and IS2010S SoC.

Figure 10-2. IS2008S and IS2010S Chip Outline Details
Figure 10-3. IS2008S and IS2010S Footprint Dimensions
Note: For the most current package drawings, refer to the Microchip Packaging Specification available at http://www.microchip.com/packaging.

The following figures illustrate the footprint dimensions and the chip outline details of the IS2013S and IS2015S SoC.

Figure 10-4. IS2013S and IS2015S Chip Outline Details
Figure 10-5. IS2013S and IS2015S Footprint Dimensions
Note: For the most current package drawings, refer to the Microchip Packaging Specification available at http://www.microchip.com/packaging.