10.1.7.7 32.768 kHz Crystal Oscillator

Table 10-46. 32.768 kHz Crystal Oscillator Characteristics
SymbolParameterConditionsMinTypMaxUnit
VDDBUSupply voltage range (VDDBU)–VIT-(1)–3.6V
IVDDBUCurrent consumption (VDDBU)(2)–––3.1μA
tSTARTStartup time(2)ESR < 50 kΩCM = 0.6 fF––3.7s
CM = 3 fF––0.8s
ESR < 90 kΩCM = 0.6 fF––5.0s
CM = 3 fF––1.0s
fOSCOperating frequency–32.7–32.8kHz
DutyDuty cycle–405060%
CPARA32KInternal parasitic capacitance(2)Between XIN32 and XOUT32–1.7–pF
Note:
  1. In this table, VIT- corresponds to the negative-going input threshold voltage of VDDBU POR (see the table VDDBU POR Characteristics). Operation of the device backup section is granted down to the VDDBU POR VIT- threshold.
  2. Simulation data

The 32.768 crystal oscillator supports a Bypass mode. See Input AC Characteristics.

Figure 10-39. 32.768 kHz Crystal Oscillator

CLEXT32K = 2x(CCRYSTAL – CPARA32K – CPCB / 2)

where CPCB is the single-ended (ground-referenced) parasitic capacitance of the printed circuit board (PCB) on XIN32 and XOUT32 tracks. As an example, if the crystal is specified for a 12.5 pF load, with CPCB=1 pF (on XIN32 and on XOUT32), CLEXT32K = 2 x (12.5 - 1.7 - 0.5) = 20.6 pF.

The table below summarizes recommendations for 32.768 kHz crystal selection.

Table 10-47. Recommended 32.768 kHz Crystal Characteristics
SymbolParameterConditionsMinTypMaxUnit
CCRYSTALCrystal load capacitanceAs specified by the crystal manufacturer6–12.5pF
RSEquivalent series resistor––5090kΩ
CMMotional capacitance–0.6–3fF
CSHUNTShunt capacitance–0.6–2pF
PONDrive level–0.2––μW