10.1.7.8 Main Crystal Oscillator

Table 10-48. Main Crystal Oscillator Characteristics
SymbolParameterConditionsMinTypMaxUnit
VDDIN33Supply voltage range (VDDIN33)(1)–3.0–3.6V
IVDDIN33Current consumption (VDDIN33)(2)–––2.6mA
tSTARTStartup time(2)–––10ms
fOSCOperating frequency range–12–48MHz
DutyDuty cycle–405060%
CPARAParasitic load capacitance(2)On XIN and XOUT–1–pF
Note:
  1. This oscillator is powered by the 2.5V regulated output of the VDDOUT25 regulator, which is supplied from VDDIN33.
  2. Simulation data

The Main crystal oscillator supports a Bypass mode. See Input AC Characteristics.

Three sets of crystal characteristics are supported with this oscillator corresponding to three operating frequency ranges:

  • Set 1: Crystal frequency is between 12 and 20 MHz. See Table 10-49.
  • Set 2: Crystal frequency is between 20 and 30 MHz. See Table 10-50.
  • Set 3: Crystal frequency is between 30 and 48 MHz. See Table 10-51.

When choosing a crystal, one and only one of these sets of characteristics must be completely satisfied.

Table 10-49. Recommended Crystal Characteristics (Set 1)
SymbolParameterConditionsMinTypMaxUnit
f0Fundamental frequency–12–20MHz
CCRYSTALLoad capacitance–6–17.5pF
CSHUNTShunt capacitance–––3pF
ESREquivalent series resistance–––100Ω
CMMotional capacitance–1.3–3.2fF
PONDrive level–150––μW

Table 10-50. Recommended Crystal Characteristics (Set 2)
SymbolParameterConditionsMinTypMaxUnit
f0Fundamental frequency–20–30MHz
CCRYSTALLoad capacitance–6–12.5pF
CSHUNTShunt capacitance–––3pF
ESREquivalent series resistance–––100Ω
CMMotional capacitance–1.3–3.2fF
PONDrive level–300––μW

Table 10-51. Recommended Crystal Characteristics (Set 3)
SymbolParameterConditionsMinTypMaxUnit
f0Fundamental frequency–30–48MHz
CCRYSTALLoad capacitance–6–10pF
CSHUNTShunt capacitanceWith ESRMAX = 60Ω––3pF
With ESRMAX = 80Ω––1pF
ESREquivalent series resistanceWith CSHUNT_MAX = 1pF––80Ω
With CSHUNT_MAX = 3pF––60Ω
CMMotional capacitance–1.3–3.2fF
PONDrive level–400––μW

Figure 10-40. Main Crystal Oscillator Schematic

CLEXT = 2 x (CCRYSTAL – CPARA – CPCB / 2).

where CPCB is the single-ended (ground-referenced) parasitic capacitance of the printed circuit board (PCB) on XIN and XOUT tracks. As an example, if the crystal is specified for a 12.5 pF load, with CPCB=1 pF (on XIN and on XOUT), CLEXT = 2 x (12.5 - 1 - 0.5) = 22 pF.