9.1 Recommended Thermal Operating Conditions

Table 9-1. Recommended Thermal Operating Conditions
Symbol	Parameter	Min	Max	Unit
T_{J_MPU}	Junction temperature range	-40	105	°C
T_{J_DDR3L}	Junction temperature range	-40	105	°C

Table 9-2. TFBGA427 Package Thermal Characteristics^(1)(2)(3)
Symbol	Parameter	Typ		Unit
R_JA	Junction-to-ambient thermal resistance	21		°C/W

Note:

R_JA = (T_{J_MPU} - T_A) / P_MPU, where T_A is the ambient temperature and P_MPU is the processor power consumption. The DDR3L SDRAM junction temperature is always lower than the MPU junction temperature.
According to the JEDEC JESD51-2 standard, with 2s2p board and 0 m/s air flow.
The package characteristics in the table above are provided according to the JEDEC JESD51-2 standard with the 2s2p board and 0 m/s air flow. These values are not directly applicable to the final application. As per JEDEC standards, these parameters represent the device mounted on a specific PCB under controlled conditions. In real-world applications, the PCB design and construction, airflow, and other factors may significantly impact thermal characteristics.