2.1 Absolute Maximum Ratings
| Parameters | Symbol | Min. | Max. | Unit |
|---|---|---|---|---|
| High-side Floating Supply Voltage | VB | −0.3V | +624 | V |
| High-side Floating Supply Offset Voltage | VS | VB − 24 | VB + 0.3 | V |
| High-side Floating Output Voltage | VHO | VS − 0.3 | VB + 0.3 | V |
| Offset Supply Voltage Transient | dVS/dt | — | 50 | V/ns |
| Low-side Fixed Supply Voltage | VCC | −0.3V | 24 | V |
| Low-side Output Voltage | VLO | −0.3V | VCC + 0.3 | V |
| Logic Supply Offset Voltage (MCP14LH21814 only) | VSS | VCC − 24 | VCC + 0.3 | V |
| Logic Input Voltage (HIN and LIN) | VIN | −0.3V | VCC + 0.3 | V |
| SOIC-8 Package Power Dissipation at TA ≤ 25°C (MCP14LH2181) | PD | — | 0.625 | W |
| SOIC-14 Package Power Dissipation at TA ≤ 25°C (MCP14LH21814) | — | 1.0 | W | |
| SOIC-8 Thermal Resistance (MCP14LH2181, see Note) | θJA | — | 200 | °C/W |
| SOIC-14 Thermal Resistance (MCP14LH21814, see Note) | θJA | — | 120 | °C/W |
| Junction Operating Temperature | TJ | — | +150 | °C |
| Lead Temperature (soldering, 10 seconds) | TL | — | +300 | °C |
| Storage Temperature Range | Tstg | −55 | +150 | °C |
Warning: Stresses above those listed
under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at those or any other conditions above
those indicated in the operational sections of this specification is not intended. Exposure to
maximum rating conditions for extended periods may affect device reliability.
Note: When mounted on a standard JEDEC 2-layer FR-4 board.