Microchip’s GestIC technology utilizes electrical near-field (E-field) sensing. The chip is
connected to electrodes that are sensing the E-field variance. The GestIC device then
calculates the user’s hand motion relatively to the sensing area in x, y, z position
data, and classifies the movement pattern into gestures in real time. In addition, by
utilizing the principles of E-field sensing, the GestIC system is immune to ambient
influences such as light or sound, which have a negative impact on the majority of other
3D technologies. Also, it allows a full-surface coverage of the electrode area with no
detection blind spots of a user’s action.
Microchip’s MGC3140 is a configurable controller. Featuring a Signal
Processing Unit (SPU), a wide range of 3D gesture applications are being processed on
the MGC3140, which allows short development cycles. Always-on 3D
sensing is enabled, even for battery-driven devices, by the chip’s low-power design and
the variety of programmable power modes. GestIC sensing electrodes are driven by a
low-voltage signal with frequencies of 42, 43, 44, 45, and 100 kHz, allowing their
electrical conductive structure to be made of any low-cost material. Figure 6-1 provides an overview of the main building
blocks of MGC3140.Figure 6-1. MGC3140
Block Diagram
The online versions of the documents are provided as a courtesy. Verify all content and data in the device’s PDF documentation found on the device product page.
