41.3.6 Thermal Characteristics
Standard Operating Conditions (unless otherwise stated) | |||||
---|---|---|---|---|---|
Param. No. | Sym. | Characteristic | Typ. | Units | Conditions |
TH01 | θJA | Thermal Resistance Junction to Ambient | — | °C/W | 28-pin SPDIP package |
— | °C/W | 28-pin SOIC package | |||
— | °C/W | 28-pin SSOP package | |||
— | °C/W | 28-pin VQFN | |||
— | °C/W | 40-pin PDIP package | |||
— | °C/W | 40-pin QFN package | |||
— | °C/W | 44-pin TQFP package | |||
TH02 | TJMAX | Maximum Junction Temperature | 150 | °C | |
TH03 | PD | Power Dissipation | — | W | PD = PINTERNAL+PI/O |
TH04 | PINTERNAL | Internal Power Dissipation | — | W | PINTERNAL = IDD x VDD(1) |
TH05 | PI/O | I/O Power Dissipation | — | W | PI/O = Σ(IOL*VOL)+Σ(IOH*(VDD-VOH)) |
TH06 | PDER | Derated Power | — | W | PDER = PDMAX (TJ-TA)/θJA(2) |
Note:
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