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RT PolarFire FPGA Packaging and Pin Descriptions
RT PolarFire FPGA Packaging and Pin Descriptions
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  2. 12 PCB Design
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  • Introduction
  • 1 Packaging Overview
  • 2 Bank Locations
  • 3 Packaging Pin Assignment
  • 4 Pin Descriptions
  • 5 Package Pin-outs
  • 6 Mechanical Drawings
  • 7 Package Material Information
  • 8 Thermal Specifications
  • 9 Package Mass
  • 10 Package Marking
  • 11 Packing and Shipping
  • 12 PCB Design
  • 13 Revision History
  • Microchip FPGA Support
  • Microchip Information

12 PCB Design

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For more information about PCB design rules for CCGA packages, see AC190: Ceramic Column Grid Array Application Note.

The online versions of the documents are provided as a courtesy. Verify all content and data in the device’s PDF documentation found on the device product page.

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