1 Packaging Overview
(Ask a Question)RT PolarFire FPGAs are available in three variations of a hermetically sealed ceramic land grid array with 1509 contacts. For flight and engineering development applications, FPGAs are available with gold-plated land pads (LG1509) or with solder columns (CG1509). For engineering development applications only, FPGAs are available with solder balls (CB1509). Each package (device variant) has various I/O banks to allow the flexibility of using different I/O standards. This document refers to the CG1509 package designator. The information presented is also applicable to the LG1509 (ceramic land grid array with no solder termination) and the CB1509 (ceramic ball grid array with solder ball termination, for prototyping purposes).
The following table lists the RT PolarFire FPGA variant, with user I/O and XCVR lanes.
| Features | RTPF500T | |
|---|---|---|
| FPGA Fabric | Logic Elements (4 LUT + DFF) | 481 |
| Math Blocks (18 × 18 MACC) | 1480 | |
| LSRAM Blocks (20 kbit) | 1520 | |
| µSRAM Blocks (64 × 12) | 4440 | |
| Total RAM (Mbits) | 33 | |
| µPROM (Kbits 9-bit bus) | 513 | |
| User DLLs/PLLs | 8 | |
| High-Speed I/O | 250 Mbps to 12.7 Gbps Transceiver Lanes | 24 |
| PCIe® Gen2 End Points/Root Ports | 2 | |
| Total I/Os | Total User I/Os | 632 |
| Packaging | Type/Size/Pitch | — |
| CG1509 (40 mm × 40 mm, 1.0 mm) | — |