3 Pinout and Package Information
The ATWILC1000-MR110xB package has an exposed paddle that must be connected to the system board ground. The module pin assignment is shown in the following figure.
Note: This pin assignment is applicable for
both the ATWILC1000-MR110PB and ATWILC1000-MR110UB modules.
The following table shows the pin description of this module.
| Pin No. | Name | Type | Description | Programmable Pull-Up Resistor |
|---|---|---|---|---|
| 1 | GPIO_61 | I/O | General purpose I/O. | — |
| 2 | I2C_SCL | I/O | I2C client clock. Used only for development debugging purposes. It is recommended to add a test point for this pin. | — |
| 3 | I2C_SDA | I/O | I2C client data. Used only for development debugging purposes. It is recommended to add a test point for this pin. | Yes |
| 4 | RESET_N | I | Active-low hard reset. When this pin is asserted low, the module is placed in the Reset state. When this pin is asserted high, the module is out of reset and functions normally. Connect to a host output that defaults low at power-up. If the host output is tri-stated, add a 1 MΩ pull-down resistor to ensure a low level at power-up. | Yes |
| 5 | NC | — | No connection. | — |
| 6 | NC | — | No connection. | — |
| 7 | NC | — | No connection. | — |
| 8 | NC | — | No connection. | — |
| 9 | GND_1 | Ground | Ground. | — |
| 10 | SDIO_SPI_CFG | I | Connect to VDDIO through a 1 MΩ resistor to enable the SPI interface. Connect to the ground to enable the SDIO interface. | No |
| 11 | WAKE | I | Host wake control. Can be used to wake up the module from Doze mode. Current FW implementation makes use of the IRQ/SDIO interface to wake up the host. | Yes |
| 12 | GND_2 | Ground | — | — |
| 13 | IRQN | O | The ATWILC1000-MR110xB device interrupt output. Connect to a host interrupt pin. | Yes |
| 14 | SD_DAT3 | SDIO = I/O UART = O | SDIO Data Line 3 from the ATWILC1000-MR110xB when the module is configured for SDIO. | Yes |
| 15 | SD_DAT2/SPI_RXD | SDIO = I/O SPI = I | SDIO Data Line 2 signal from ATWILC1000-MR110xB when the module is configured for SDIO. SPI MOSI (Host Out Client In) pin when the module is configured for SPI. | Yes |
| 16 | SD_DAT1/SPI_SSN | SDIO = I/O SPI = I | SDIO Data Line 1 from ATWILC1000-MR110xB when the module is configured for SDIO. Active low SPI client select from the ATWILC1000 when the module is configured for SPI. | Yes |
| 17 | SD_DAT0/SPI_TXD | SDIO = I/O SPI = O | SDIO Data Line 0 from the ATWILC1000-MR110xB when the module is configured for SDIO. SPI MISO (Host In Client Out) pin from ATWILC1000 when the module is configured for SPI. | Yes |
| 18 | SD_CMD/SPI_CLK | SDIO = I/O SPI = I | SDIO CMD line from ATWILC1000-MR110xB when the module is configured for SDIO. SPI Clock from ATWILC1000 when the module is configured for SPI. | Yes |
| 19 | SD_CLK | SDIO = I UART = I | SDIO clock line for the ATWILC1000-MR110xB when the module is configured for SDIO. | Yes |
| 20 | VBATT | Power supply | Power supply pin for the DC/DC convertor. | Yes |
| 21 | GPIO_11 | I/O | General purpose I/O. | Yes |
| 22 | CHIP_EN | I | Module enable. High level enables the module, low level places the module in Power-Down mode. Connect to a host Output that defaults low at power-up. If the host output is tri-stated, add a 1 MΩ pull-down resistor if necessary to ensure a low level at power-up. | No |
| 23 | VDDIO | Power supply | I/O power supply. Must match host I/O voltage. | — |
| 24 | 1P3V_TP | — | 1.3V VDD Core Test Point. Decouple with 10 uF and 0.01 uF to the GND close to pin 24. | — |
| 25 | GPIO_31 | I/O | General purpose I/O. By default, UART receives input from the ATWILC1000-MR110xB. Used only for development debugging purposes. It is recommended to add a test point for this pin. | Yes |
| 26 | GPIO_41 | I/O | General purpose I/O. | Yes |
| 27 | GPIO_51 | I/O | General purpose I/O. By default, UART transmits output to the ATWILC1000-MR110xB. Used only for development debugging purposes. It is recommended to add a test point for this pin. | Yes |
| 28 | GND_3 | Ground | — | — |
| 29 | Paddle | Ground | Exposed paddle GND. This pad must be soldered to the system ground. | — |
Note:
- Use of the GPIO functionality is not supported by the WILC1000 FW. The data sheet will be updated once the support for this feature is added.
The following table provides the ATWILC1000-MR110xB module package dimensions.
| Parameter | Value | Units |
|---|---|---|
| Package Size | 21.7 x 14.7 x 2.1 | mm |
| Pad Count | 28 | — |
| Total Thickness | 2.11 | mm |
| Pad Pitch | 1.016 | |
| Pad Width | 0.82 | |
| Exposed Pad size | 3.7 x 3.7 |