1.1.1 PolarFire SoC Decoupling Capacitors

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The following tables list the requirement of all decoupling capacitors for the MPFS460TS - FCG1152, MPFS250TS - FCG1152, MPFS250TS - FCVG484, MPFS250TS - FCSG536, MPFS250TS - FCVG784, and MPFS095T/MPFS025T - FCS325 devices.

Table 1-2. Power-Supply Decoupling Capacitors¹—MPFS460TS - FCG1152 (1 mm)
Pin Name	Ceramic										Tantalum
Pin Name	1 nF	4.7 nF	22 nF	10 nF	47 nF	0.1 μF	1 μF	4.7 μF	10 μF	47 μF	330 μF
VDD	—	—	—	—	—	4	—	—	—	—	3
VDD18	—	—	—	—	—	2	—	—	—	2	—
VDDA	—	3	—	1	—	6	—	—	—	2	—
VDDA25	—	—	—	—	—	4	—	—	—	1	—
VDD25	—	—	—	—	—	5	—	—	1	—	—
VDDAUXGPIO	—	—	—	—	—	2	—	—	—	1	—
GPIO	—	—	—	—	—	2	—	—	—	1	—
HSIO	—	—	—	—	—	2	—	—	—	1	—
VDD_XCVR_CLK	—	—	—	—	—	2	—	—	1	—	—
SERDES_VREF	—	—	—	—	—	2	—	—	—	—	—
VDDI3	—	—	—	—	—	2	—	—	1	—	—
Bank 2	—	—	—	—	—	2	—	—	1	—	—
Bank 4	—	—	—	—	—	2	—	—	1	—	—
Bank 5	—	—	—	—	—	2	—	—	1	—	—
Bank 6 MSS DDR	—	—	—	1	—	1	—	—	—	1	—

Note: 1. The guidelines are provided on how to effectively decouple only the PolarFire SoC device. If the power source is placed on a different PCB or delivered through interconnects (flex cables or connectors), ensure an effective power delivery to the PolarFire SoC device. Follow the recommended operational conditions as per PolarFire SoC Datasheet.

Table 1-3. Power-Supply Decoupling Capacitors¹—MPFS250TS - FCG1152 (1 mm)
Pin Name	Ceramic									Tantalum
	1 nF	4.7 nF	22 nF	10 nF	47 nF	0.1 μF	1 μF	10 μF	47 μF	330 μF
VDD	—	—	2	5	2	1	1	—	1	2
VDD18	—	—	—	1	—	1	—	—	2	—
VDDA	—	3	—	1	—	6	—	—	2	—
VDDA25	2	—	—	—	—	2	—	—	1	—
VDD25	1	—	—	2	—	2	—	—	1	—
VDDAUX (GPIO)	—	1	—	1	—	1	—	—	1	—
GPIO Bank	1	—	—	—	—	—	—	—	1	—
HSIO Bank	—	—	—	—	—	2	—	—	1	—
VDD_XCVR_CLK	—	—	—	—	—	2	—	1	—	—
SERDES_VREF	—	—	—	—	—	2	—	—	—	—
VDDI3	—	—	—	—	—	2	—	1	—	—
Bank 2	—	—	—	—	—	2	—	1	—	—
Bank 4						2		1
Bank 5	—	—	—	—	—	2	—	1	—	—
Bank 6 MSS DDR	—	—	—	1	—	1	—	—	1	—

Note:

The guidelines are provided on how to effectively decouple only the PolarFire SoC device. If the power source is placed on a different PCB or delivered through interconnects (flex cables or connectors), ensure an effective power delivery to the PolarFire SoC device. Follow the recommended operational conditions as per PolarFire SoC Datasheet.

Table 1-4. Power-Supply Decoupling Capacitors¹—MPFS250TS/MPFS160TS/MPFS095TS - FCVG484 (0.8 mm)
Pin Name	Ceramic										Tantalum
Pin Name	1 nF	4.7 nF	22 nF	10 nF	47 nF	0.1 μF	1 μF	4.7 μF	10 μF	47 μF	330 μF
VDD	—	—	2	5	2	1	—	—	—	—	2
VDD18	—	—	—	1	—	1	—	—	1	1	—
VDDA	—	2	—	—	—	6	—	—	—	1	—
VDDA25	—	—	—	—	2	2	—	—	1	1	—
VDD25	4	—	—	1	—	3	—	—	—	1	—
VDDAUX (GPIO)	—	—	—	2	1	2	—	—	—	1	—
GPIO	—	—	—	—	—	—	—	—	—	2	—
HSIO	—	—	—	—	—	—	—	—	—	1	—
VDD_XCVR_CLK	—	—	—	—	—	2	—	—	1	—	—
SERDES_VREF	—	—	—	—	—	2	—	—	—	—	—
VDDI3	—	—	—	—	—	2	—	—	1	—	—
Bank 2	—	—	—	—	—	2	—	—	1	—	—
Bank 4	—	—	—	—	—	2	—	—	1	—	—
Bank 5	—	—	—	—	—	2	—	—	1	—	—
Bank 6 MSS DDR	—	—	—	—	—	1	1	—	—	1	—

Note:

The guidelines are provided on how to effectively decouple only the PolarFire SoC device. If the power source is placed on a different PCB or delivered through interconnects (flex cables or connectors), ensure an effective power delivery to the PolarFire SoC device. Follow the recommended operational conditions as per PolarFire SoC Datasheet.

Table 1-5. Power-Supply Decoupling Capacitors¹—MPFS250TS/MPFS160TS/MPFS095TS - FCSG536 (0.5 mm)
Pin Name	Ceramic										Tantalum
Pin Name	1 nF	4.7 nF	22 nF	10 nF	47 nF	0.1 µF	1 µF	4.7 µF	10 µF	47 µF	100 µF	330 µF
VDD	—	—	—	—	—	—	—	—	—	2	1	2
VDD18	—	—	—	1	—	1	—	—	—	2	—	—
VDDA	3	—	—	—	—	1	—	—	—	2	—	—
VDDA25	2	—	—	—	—	2	—	—	—	1	—	—
VDD25	—	—	—	—	—	3	—	—	—	1	—	—
VDDAUX (GPIO)	—	1	—	1	—	1	—	—	—	1	—	—
GPIO Bank	—	—	—	—	4	4	—	—	—	2	—	—
HSIO Bank	—	—	—	—	—	2	—	—	—	2	—	—
VDD_XCVR_CLK	—	—	—	—	—	2	—	—	1	—	—	—
SERDES_VREF	—	—	—	—	—	2	—	—	—	—	—	—
Bank 3 JTAG	—	—	—	—	—	2	—	—	1	—	—	—
Bank 2	—	—	—	—	—	2	—	—	1	—	—	—
Bank 4	—	—	—	—	—	2	—	—	1	—	—	—
Bank 5	—	—	—	—	—	2	—	—	1	—	—	—
Bank 6 MSS DDR	—	—	—	—	—	—	1	—	—	1	—	—

Note:

The guidelines are provided on how to effectively decouple only the PolarFire SoC device. If the power source is placed on a different PCB or delivered through interconnects (flex cables or connectors), ensure an effective power delivery to the PolarFire SoC device. Follow the recommended operational conditions as per PolarFire SoC Datasheet.

Table 1-6. Power-Supply Decoupling Capacitors¹—MPFS250TS/MPFS160TS/MPFS095TS/MPFS025TS - FCVG784 (0.8 mm)
Pin Name	Ceramic										Tantalum
Pin Name	1 nF	2.2 nF	3.3 nF	4.7 nF	10 nF	47 nF	0.1 µF	1 µF	10 µF	47 µF	330 µF
VDD	—	—	—	—	—	3	3	3	—	1	2
VDD18	—	—	—	1	1	—	1	—	—	2	—
VDDA	—	2	—	—	2	—	1	—	—	2	—
VDDA25	1	—	—	—	—	—	1	—	—	1	—
VDD25	1	—	—	—	2	—	2	—	—	1	—
VDDAUX (GPIO)	—	—	—	1	1	—	1	—	—	1	—
GPIO Bank	1	—	—	1	—	—	1	—	—	1	—
HSIO Bank	1	—	—	1	—	—	1	—	—	1	—
VDD_XCVR_CLK	—	—	—	—	—	—	2	—	1	—	—
SERDES_VREF	—	—	—	—	—	—	2	—	—	—	—
Bank 3 JTAG	—	—	—	—	—	—	2	—	1	—	—
Bank 2	—	—	—	—	—	—	2	—	1	—	—
Bank 4	—	—	—	—	—	—	2	—	1	—	—
Bank 5	—	—	—	—	—	—	2	—	1	—	—
Bank 6 MSS DDR	1	—	1	1	1	—	1	—	—	1	—

Note:

The guidelines are provided on how to effectively decouple only the PolarFire SoC device. If the power source is placed on a different PCB or delivered through interconnects (flex cables or connectors), ensure an effective power delivery to the PolarFire SoC device. Follow the recommended operational conditions as per PolarFire SoC Datasheet.

Table 1-7. Power-Supply Decoupling Capacitors¹—MPFS095TS/MPFS025TS - FCSG325 (0.5 mm)
Pin Name	Ceramic										Tantalum
	1 nF	4.7 nF	22 nF	10 nF	47 nF	0.1 μF	1 μF	4.7 μF	10 μF	47 μF	330 μF
VDD	—	4	—	1	—	1	—	—	1	1	1
VDD18	—	—	—	—	—	2	—	—	—	2	—
VDDA	2	—	—	—	—	2	—	—	1	—	—
VDDA25	1	—	—	—	—	1	—	—	—	1	—
VDD25	—	—	—	—	—	5	—	—	1	—	—
VDDAUXGPIO	—	—	—	—	—	2	—	—	—	1	—
GPIO Bank	—	—	—	—	—	2	—	—	—	1	—
HSIO Bank	—	—	—	—	—	2	—	—	—	1	—
VDD_XCVR_CLK	—	—	—	—	—	2	—	—	1	—	—
SERDES_VREF	—	—	—	—	—	2	—	—	—	—	—
JTAG Bank 3 (VDDI3)	—	—	—	—	—	2	—	—	1	—	—
Bank 2	—	—	—	—	—	2	—	—	1	—	—
Bank 4	—	—	—	—	—	2	—	—	1	—	—
Bank 5	—	—	—	—	—	2	—	—	1	—	—
Bank 6 MSS	—	—	—	—	—	—	1	—	—	1	—

Note:

The guidelines are provided on how to effectively decouple only the PolarFire SoC device. If the power source is placed on a different PCB or delivered through interconnects (flex cables or connectors), ensure an effective power delivery to the PolarFire SoC device. Follow the recommended operational conditions as per PolarFire SoC Datasheet.

Decoupling capacitors other than those listed in the preceding tables can be used, if the physical sizes of capacitors meet or exceed the performance of the network given in this example. Substitution would require analyzing the resulting power distribution system's impedance versus frequency to ensure that no resonant impedance spikes the result. See Figure 1-1 for power supply design.

For more information about the internal package capacitance for power supplies associated with PolarFire SoC packages, see PolarFire SoC FPGA Packaging and Pin Descriptions User Guide.

The following table lists the required decoupling capacitors for PolarFire SoC packages.

Table 1-8. Recommended Decoupling Capacitors For PolarFire SoC Devices
De-Cap Value	Part Number	Package	Description
1 nF	CL05B102KO5NNNC	0402	For 1 mm package
22 nF	GRM155R71C223KA01D	0402	For 1 mm package
10 nF	GRM155R71C103KA01D	0402	For 1 mm package
0.1 µF	GRM155R71C104KA88D	0402	For 1 mm package
10 nF	GRM15XR11C103KA86	0402	For 1 mm package
4.7 nF	GRM155R11H472KA01	0402	For 1 mm package
10 µF	GRM21BR71A106KE51	0805	Bulk Caps (for 0.5, 0.8, and 1 mm)
47 µF	GRM31CR61A476KE15	1206	Bulk Caps (for 0.5, 0.8, and 1 mm)
330 µF	T495D337K010ATE150	2917	Bulk Caps (for 0.5, 0.8, and 1 mm)
1 nF	GRM033R71C102KA01	0201	For 0.8 and 0.5 mm package
2.2 nF	GRM033R71C222KA88D	0201	For 0.8 mm package
10 nF	GRM033R71A103KA01	0201	For 0.8 and 0.5 mm package
0.1 µF	GRM033C71C104KE14	0201	For 0.8 and 0.5 mm package
1 µF	GRM155R70J105KA12J		For 0.5 mm, 0.8 mm, and 1 mm package
47 nF	GRM155R71C473KA01J		For 0.5 mm, 0.8 mm, and 1 mm package

Important: Equivalent capacitor values can be used from a different vendor. For more information about the Packaging Decoupling Capacitors, see PolarFire SoC FPGA Packaging and Pin Descriptions User Guide.