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SAMR30 IEEE® 802.15.4™ Sub-1GHz Module Data Sheet

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10 Mechanical Description
10.2 Footprint

Introduction
Features
1 Ordering Information and Module Marking
2 Package Information
3 Module Block Diagram
4 Pinout Information
5 Nonvolatile Memory Information
6 Boot Loader
7 Module Description
8 Radio Transceiver Usage
9 Electrical Characteristics
10 Mechanical Description
- 10.1 Module Outline Drawings
- 10.2 Footprint
11 Design Considerations
12 Application Reference Design
13 Regulatory Approval
14 Continuous Transmission Test Mode Errata
15 Reference Documentation
16 Document Revision History
Microchip Information

10.2 Footprint

The recommended land pattern is shown in the following figure.

Figure 10-2. Recommended Base Board Footprint

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