10.1 Recommended Thermal Operating Conditions

Table 10-1. Recommended Thermal Operating Conditions
Symbol	Parameter	Conditions	Min	Max	Unit
T_A	Ambient temperature range	SAM9X75D5M(T)-V devices	-40	105	°C
		SAM9X75D5M(T)-I devices		85	°C
		SAM9X75D1G(T)-I devices			°C
		SAM9X75D2G(T)-I devices			°C
T_{J_MPU}	Junction temperature range	–		125	°C
T_{J_DDRx}	Junction temperature range	–		125	°C

Table 10-2. BGA243 Package Thermal Characteristics⁽¹⁾⁽²⁾
Symbol	Parameter	Typ	Unit
R_JC	Junction-to-case thermal resistance	7	°C/W
R_JB	Junction-to-board thermal resistance	25	°C/W
Ψ_J-top	Junction-to-package-top characterization parameter	0.31	°C/W

Note:

R_JA = (T_{J_MPU} - T_A) / P_TOT, where T_A is the ambient temperature and P_TOT is the power consumption of both the processor and the embedded DDR memory. The DDR SDRAM junction temperature is always lower than the MPU junction temperature.
The package characteristics in the above table are provided according to the JEDEC JESD51-2 standard with the 2s2p board and 0 m/s air flow. These values are not directly applicable to the final application. As per JEDEC standards, these parameters represent the device mounted on a specific PCB under controlled conditions. In real-world applications, the PCB design and construction, airflow, and other factors may significantly impact thermal characteristics.