49.2 Operating Frequencies and Thermal Specifications
| Param. No. | VDDIOx, AVDD Range | Temp. Range (in °C) | Max MCU Frequency | Comments | ||
|---|---|---|---|---|---|---|
| DC_7 | 1.71 to 3.63V | -40°C to +125°C | FCLK_1 MHz | Extended | ||
| Rating | Symbol | Min. | Typ. | Max. | Unit | ||
|---|---|---|---|---|---|---|---|
| Extended
Temperature Range Operating Ambient Temperature Range Operating Junction Temperature Range | TA TJ | -40 --- | — | 125 145 | °C °C | ||
|
Power Dissipation: Internal Chip Power Dissipation: PINT = (VDDIOx x (IDD –∑ IOHVDDIOx))+ (AVDD x (IDDANA - ∑ IOHAVDD)) + (VDDREG x IDDREG) I/O Pin Power Dissipation: PI/O = ∑ ((VDDIOx – VOHVDDIOx) x IOHVDDIOx) + ∑ (VOL x IOLVDDIOx) + ∑ ((AVDD – VOHAVDD) x IOHAVDD) + ∑ (VOL x IOLAVDD) | PD | PINT + PI/O | W | ||||
| Maximum Allowed Power Dissipation | PDMAX | (TJ – TA)/θJA | W | ||||
| Characteristics | Symbol | Typ. | Max. | Unit | |||
|---|---|---|---|---|---|---|---|
| Thermal Resistance, 48-pin TQFP (7x7x1 mm) Package | θJA | 47.0 | — | °C/W | |||
| Thermal Resistance, 64-pin TQFP (10x10x1 mm) Package | θJA | 44.8 | — | °C/W | |||
| Thermal Resistance, 100-pin TQFP (14x14x1 mm) Package | θJA | 41.1 | — | °C/W | |||
| Thermal Resistance, 48-pin VQFN (7x7x0.9 mm) Package | θJA | 22.3 | — | °C/W | |||
| Thermal Resistance, 64-pin VQFN (9x9x1 mm) Package | θJA | 20.5 | — | °C/W | |||
|
Note:
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