9 Packing and Shipping
(Ask a Question)The PolarFire SoC series of devices are packed in trays, which are used to pack most of the Microchip surface-mount devices. Trays provide excellent protection from mechanical damage. In addition, they are manufactured using the anti-static material to provide limited protection against ESD damage.
| Package | Maximum Number of Devices per Tray | Maximum Number of Trays per Stack | Maximum Number of Units per Inner Carton |
|---|---|---|---|
| FCG1152 | 24 | 5 | 120 |
| FCVG784 | 60 | 5 | 300 |
| FCVG484 | 84 | 5 | 420 |
| FCSG536 | 90 | 5 | 450 |
| FCSG325 | 144 | 5 | 720 |